R&D Process Engineer

Key Responsibilities

• Design, collect data, analyze and compile reports on a variety of difficult process engineering experiments, within safety guidelines
• Perform hardware characterization on a variety of difficult systems, within safety guidelines
• Troubleshoot a variety of complex problems, perform Root Cause Analysis and resolve a variety of difficult process engineering issues
• Generate internal and external documentation for products, presentations and technical reports
• Interact with customers to resolve a variety of difficult process engineering issues/problems with limited supervision
• Measure film properties and interpret data
• Identify, select and work with vendors and suppliers with limited supervision
• Implement new technology, products and analytical instrumentation

Requirements:

• PhD or Master or Bachelor in Materials Science, Chemical Engineering, Chemistry or Physics or related field
• At least 2 years of relevant experiences in semiconductor packaging process, e.g. Fan-Out Wafer Level Packaging, Panel-level Packaging, Thermo-Compression Bonding, Hybrid Bonding, Die Attach, etc.
• Good communication and interpersonal skills
• Problem-solver attitude with determination and quality-mindset

Work Location:

• Science Park II (Moving to Tampines starting from mid-2027)

## Qualifications

### Education:

Bachelor's Degree

### Skills

### Certifications:

### Languages:

### Years of Experience:

4 - 7 Years

### Work Experience:

## Additional Information

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### Shift:

Day (Singapore)

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### Travel:

No

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### Relocation Eligible:

No

### Referral Payment Plan:

None

Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.