Principal/ Staff Engineer, Advanced Packaging Process Integration

As the Principal/ Staff Engineer, Advanced Packaging Process Integration, be part of an exciting team working on cutting-edge advanced packaging process technologies. To drive the development and validation of module process and integration the solutions to enable advanced packaging process technologies in the world of mobile, IoT, consumer and high-performance computing area. Work with various teams from inside and outside of Applied Materials to help develop leading-edge packaging solutions for our partners taking them from concept to mass production. Responsibilities will include advanced packaging process integration development, program management, execute gap-analysis, risk-assessment and mitigation, and monitor and track integration process flow development to make sure integration projects are completed successfully and delivered on time. This position is based in Singapore.

Key Responsibilities

Process Development:

• Lead the development and optimization of advanced packaging processes such as 2.5D/3D IC packaging, wafer-level packaging, and other emerging technologies.

• Collaborate with R&D teams to design and implement new packaging techniques.

Project Management:

• Manage projects from conception through to production, ensuring timelines and budgets are met.

• Coordinate cross-functional teams to achieve project objectives.

Technical Leadership:

• Provide technical guidance and mentorship to the engineering team.

• Stay updated with the latest advancements in semiconductor packaging and integrate them into the company's processes.

Quality Assurance:

• Ensure that all packaging processes meet the required quality standards and industry regulations.

• Implement and monitor process control systems to ensure high yield and reliability.

Collaboration and Communication:

• Work closely with design, manufacturing, and supply chain teams to ensure seamless integration of packaging solutions.

• Communicate effectively with stakeholders, including customers and senior management, to provide updates and gather requirements.

Problem Solving:

• Identify and resolve technical issues related to packaging processes.

• Conduct root cause analysis and implement corrective actions.

Requirements

Education:

• A bachelor's degree in engineering, materials science, physics, or a related field is typically required. An advanced degree (Master's or Ph.D.) is often preferred.

Experience:

• Extensive experience in semiconductor process integration, with a focus on advanced packaging technologies.

• Proven track record of managing complex projects and leading engineering teams.

Skills:

• Strong understanding of semiconductor fabrication and packaging processes.

• Excellent project management and leadership skills.

• Proficient in data analysis and problem-solving techniques.

• Strong communication and interpersonal skills.

Knowledge:

• Familiarity with industry standards and regulatory requirements for semiconductor packaging.

• Up-to-date knowledge of emerging trends and technologies in semiconductor packaging.

Work Location:

• Science Park II (Moving to Tampines in end 2026)

## Qualifications

### Education:

Doctorate Degree

### Skills

### Certifications:

### Languages:

### Years of Experience:

7 - 10 Years

### Work Experience:

## Additional Information

###

### Shift:

Day (Singapore)

###

### Travel:

###

### Relocation Eligible:

No

### Referral Payment Plan:

None

Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.