Mechanical Engineer IV - Wet Chemical Tool

# Roles & Responsibilities

• Lead end-to-end mechanical system design for semiconductor equipment, translating product and module requirements into robust architectures, with emphasis on system integration, fluid handling, and operating environments; experience with wet process or electrochemical systems (e.g., Copper plating, Wafer cleaning) is strongly preferred.
• Drive engineering execution from concept through release, including design, analysis, supplier engagement, build, and validation of complex subsystems (mechanical, fluid systems, and assemblies).
• Define and optimize system-level design tradeoffs across performance, reliability, manufacturability, cost, and serviceability, including fluid flow behavior and material interactions.
• Design and develop mechanical and fluid delivery subsystems, including layouts, schematics, and specifications; ensure appropriate material selection for operating environments.
• Perform and validate engineering analyses (thermal, structural, tolerance, and flow/fluids) using first-principles calculations and simulation tools (e.g., FEA/CFD).
• Plan and execute structured tests to validate designs, characterize operating windows, and establish design margins; analyze data using tools such as JMP and MS Excel to derive statistically sound conclusions.
• Communicate technical results through presentations to cross-functional teams, management, and customers.
• Create, specify, and review engineering documentation and release through PLM systems (e.g., Teamcenter), ensuring accuracy and configuration control.

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# Qualifications

• PhD or master’s degree in mechanical engineering with 5–7 years of applicable experience, preferably in the semiconductor industry.
• Experience in semiconductor equipment design or troubleshooting. Experience with wet process or electrochemical systems (e.g., Copper plating, Wafer cleaning) is strongly preferred
• Proficiency with 3D CAD tools such as Siemens NX, Creo (Pro/ENGINEER), or SolidWorks.
• Experience with engineering analysis tools (e.g., ANSYS, CFD ACE, COMSOL) is a plus.
• Demonstrated strength in at least one technical domain: thermal engineering, compressible flow, mechanical design, or machining/manufacturing processes.
• Experience with statistical data analysis tools such as JMP and MS Excel.
• Experience using FEA packages (Ansys, CFD-Ace, ComSol, etc.) is a plus.
• Excellent written and verbal communication skills, with the ability to create clear, concise engineering documentation.
• Ability to prioritize and manage multiple projects in a fast-paced product development environment.

## Qualifications

### Education:

Bachelor's Degree

### Skills

### Certifications:

### Languages:

### Years of Experience:

7 - 10 Years

### Work Experience:

## Additional Information

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### Shift:

10-Day 8-Hr (United States of America)

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### Travel:

Yes, 20% of the Time

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### Relocation Eligible:

Yes

### Referral Payment Plan:

None

U.S. Salary Range:

$147,000.00 - $202,500.00

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.