Engineer II, Product Test Engineering

The Role: 

We are seeking a highly motivated CMP Product Test Engineer to join our team in TTC, Hsinchu. In this role, you will support R&D and process development activities by planning and executing technical experiments, collecting and analyzing data, and providing timely feedback to engineering teams. You will be responsible for conducting test runs, preparing detailed reports and identifying processes, and equipment-related issues. This position offers the opportunity to work closely with engineers and scientists in the development and optimization of next-generation CMP technologies and processes. 

In this role you will: 

• Prepare and execute CMP process experiments and wafer characterization activities.  

• Operate CMP polishing and metrology equipment safely and efficiently.  

• Analyze test data and communicate findings through technical reports and team discussions. 

• Troubleshoot process and equipment issues to improve performance and repeatability.  

• Support process development, optimization, and feasibility studies.  

• Collaborate with engineers, scientists, and cross-functional teams on technology development projects.  

• Participate in cleanroom continuous improvement and safety initiatives.  

• Maintain accurate documentation and ensure compliance with EHS and quality standards. 

Traits we believe make a strong candidate: 

• Bachelor’s degree in engineering, Chemistry, or a related field 

• 2+ years’ experience working in semiconductor manufacturing, CMP process, wafer fabrication, or cleanroom environments. 

• Able to work independently in a fast-paced environment 

• Solid communication skills 

• Work in close collaboration with global engineering teams 

• Proficiency in Microsoft Office applications, including Word, Excel, and PowerPoint.  

• Experience with statistical analysis software such as JMP, Minitab, or SAS is preferred. 

• Hands-on knowledge and experience in CMP processes is highly desirable. 

• Familiarity with defectivity and wafer thickness metrology is a plus. 

Your success will be measured by: 

• Effectively planning and executing projects with clear goals, milestones, and deliverables.  

• Demonstrating strong ownership and the ability to work independently with minimal supervision.  

• Managing priorities and delivering results in a dynamic and evolving environment.  

• Showing initiative, accountability, and a strong commitment to achieving objectives.  

• Building productive relationships through effective teamwork and communication.  

• Applying critical thinking and problem-solving skills to overcome technical challenges.  

• Continuously learning from experience and driving improvements to prevent recurring issues.  

• Maintaining high standards of safety, quality, and operational excellence.