Senior Staff Engineer / Principle Engineer (SON Package)

#WeAreIn for jobs that impact everyone's life. Optimize. Innovate. Deliver. Join us in redefining manufacturing excellence. As a Senior Staff / Principle Engineer Molding / Mark, Trim & Form / Die Attach / Clip Attach / Final Test, Scan & Pack (SON Package) in our Manufacturing and Operations team, find yourself in a high-tech world where silicon wafers evolve into cutting-edge products. In our advanced cleanroom environment, every detail count, and your expertise will help shape the future, one innovation at a time. Are you in? Your role Key responsibilities in your new role Lead engineering activities for Molding / Mark, Trim & Form / Die Attach and Clip Attach / Final Test, Scan and Packing processes for SON  product Drive process optimization to improve test yield, quality, productivity, equipment utilization, and manufacturing cost Lead process & equipment qualification and process characterization. Your profile Qualifications and skills to help you succeed  · Bachelor's Degree, Master’s degree or PhD in Engineering (Electrical, Electronics,

Mechanical, Materials, Manufacturing, Physics, Computer or related

discipline) · Minimum10 years of semiconductor

manufacturing experience, with significant exposure to: o Mold : Transfer Molding processes, BESI,

ASM and Asahi equipment. o Mark, Trim & Form : Marking Processes ,

Trim & Form operations , BESI and ASM equipment, TDSON

or similar leadframe-based packages. o Die Attach / Clip Attach : Die Attach process

or similar leadframe packages, Clip Attach Technology , Solder Paste

and reflow processes , ASM Die Bonder platforms , Knowledge of

leadframe-based power package assembly processes . o Final Test, Scan and Pack : Final Test operations,

ETS88 Test Systems , SRM (Scan and Reel Module) processes, ExisTech Handler platforms. · Preferred Qualifications o Die Attach / Clip Attach - Expertise in ASM AD series Die Bonders or

equivalent platforms - Experience with solder paste, clip attach, and

power package assembly technologies - Familiarity with TDSON, STOLL or similar

leadframe-based packages . o Final Test, Scan and Pack - Experience with ETS88 test platform

development, optimization, and troubleshooting - Strong knowledge of handler-test cell

integration and automation systems . · Strong troubleshooting

and problem-solving skills · Excellent communication ,

leadership , and project management capabilities · Ability to

work effectively in a cross-functional and multinational

environment . #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.  Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon.