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External Package Innovation Engineer

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Ā·

Aug 5, 2026

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Location
Kuala Lumpur, Malaysia
Workplace
Onsite
Type
Full-time
Department
Engineering
Source
Workday

Description

Hiring: External Package Innovation Engineer

We are looking for a highly motivated engineer to drive external package innovation initiatives and collaborate closely with OSAT partners for successful project execution.

šŸ”¹Ā Role Overview

As anĀ EPI engineer, you will act as both aĀ Role OwnerĀ andĀ Key SupporterĀ for OSAT-related development activities, ensuring robust execution from concept through production.

šŸ”¹Ā Key Responsibilities

āœ…Ā 1. Role Owner (Strategic & Governance)

  • Own and leadĀ OSAT-wide and cross-OSAT initiatives
  • Define and deployĀ standard development templates and success criteriaĀ across OSATs
  • Drive deployment ofĀ Best Known Methods (BKM)Ā and lessons learned
  • Develop and maintainĀ technology roadmap and capability assessmentĀ for each OSAT site
  • ProvideĀ Package Innovation (PI) inputĀ for:
    • External site sourcing strategy
    • Site selection process (jointly with interface manager)
  • LeadĀ project governance, including:
    • Overall project summaries
    • Stoplight reporting
    • Regular reviews per OSAT site

āœ…Ā 2. Supporter (Execution & Project Delivery)

  • SupportĀ NPI & NTI projectsĀ executed at external OSAT factories
  • Ensure OSAT compliance with:
    • Development processes
    • Required documentation/templates
  • Drive alignment onĀ SME (Subject Matter Expert) assignmentĀ at OSAT
  • Support and resolveĀ technical and project issuesĀ on-site and across time zones
  • EnsureĀ assembly readiness and safe production launch

šŸ”¹Ā Stakeholder Collaboration

You will work closely with cross-functional teams, including:

  • Project Leaders & Development Managers
  • Designers & Materials Engineers
  • Tech Integration & Modelling teams (Electrical, Mechanical, Thermal)
  • API and WLP/PLP/FC SMEs
  • OSAT partners

šŸ”¹Ā What We’re Looking For

  • Strong experience inĀ semiconductor packaging (especially with handson assembly process experience such as pre-assembly and wire bonding).Ā  Previous exposure to OSAT ecosystem is an added advantage.
  • Proven ability to manageĀ cross-site, cross-functional projects
  • Solid understanding ofĀ NPI/NTI development flows
  • ExcellentĀ stakeholder management and communication skills
  • Ability to driveĀ standardization, governance, and technical problem-solving

🌟 Why Join Us

  • Opportunity to leadĀ high-impact package innovation initiatives
  • Work withĀ global teams and OSAT partners for wide exposure and fast knowledge & skill growth
  • DriveĀ technology roadmap and next-generation packaging solutions


More information about NXP in Malaysia...

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Skills

Compliance

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