Sr Advanced Packaging Technology Development Engineer, Bonding process

Req. ID:

JR108483 Sr Advanced Packaging Technology Development Engineer, Bonding process

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Specific Responsibilities:

1\. Drive HBM process development and yield improvement in WSS process.

2\. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development

4\. Support project on-site execution and make decisions as technical consultant

5\. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues

6\. Generate internal and external documentation for presentations and technical reports

Technology Development:

1\. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs.

2\. Project engagement with cross-team interaction, providing expert contribution in materials characterization.

3\. Coordinate mechanical characterization for advanced packaging development efforts globally including US, Japan, and Singapore site.

4\. Provide recommendations for test structure and test vehicle design for material property evaluation.

5\. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technology roadmaps.

Qualifications:

1\. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields

2\. Must be at least 2 years experience in BONDING related works

3\. Solid understanding of WSS/BOND advanced technilogies, 1 or more in below fields:

a) Temporary bonding/debonding (TBDB)

b) Hybrid Bonding

c) Fusion Bonding / Direct wafer bonding

4\. Knowledge of bonding mechanisms - surface activation, adhesion physics, interface energy, thermo-compression and plasma-assisted bonding

5\. Hands-on experience with bonding-related tools is a plus, such as SUSS/EVG/TEL, etc

6\. Innovative / integration mindset with independent thinking

7\. Good team player with a high motivation

8\. Fluent communication in both English and Chinese

AI Relevant Job Responsibilities:

\- Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

\- Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

\- Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business

Job Profile(s):

Product Development Engineer 3

Relocation level: (TBD)

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As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

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