Hiring.Camp

Principal Product Engineer

Cadence Design

·

Sep 3, 2026

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Location
ZHUBEI 01, Taiwan
Type
Full-time
Department
Engineering
Seniority
Lead
Closing date
Today
Source
Workday

Description

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

Job Description

  • Product Engineer for Integrity 3D-IC
  • Developing and integrating various EDA tools and engines into the consolidated 3D-IC platform.
  • Working closely with R&D group to develop, integrate and enhance EDA solutions, including 3D-IC system planning, implementation, and analysis/verification.
  • Collaborating with the field teams for customer engagement and providing technical support and guidance.
  • Communicating and coordinating with multiple R&D groups and field teams to enable EDA solutions to customers.

Position Requirements

  • BS degree with 7+ years or MS degree and 5+ years of engineering work experience in the semiconductor industry.
  • Experience in physical implementation, place-and-route, and signoff tools. Familiar with Cadence digital flows and advanced packaging design with Allegro Package Designer.
  • Knowledge and experience in 3D-IC system planning, implementation, analysis, and signoff flows is a plus
  • Hands-on experience in scripting languages, such as TCL, Perl, YAML, and Python.
  • Good trouble-shooting and technical documentation skills.

A self-motivated, proactive leaner and team player, with excellent communication skills and a customer-oriented attitude.

We’re doing work that matters. Help us solve what others can’t.

Skills

PythonPerl

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