- Location
- Bay Area
- Workplace
- Onsite
- Type
- Full-time
- Department
- Engineering
- Seniority
- Senior
- Experience
- 5+ years
- Education
- PhD
- Source
- Lever
Description
Join the leading chiplet interconnect startup! We are seeking an experienced Senior/Staff Packaging Engineer specializing in electro-thermal simulation to join our advanced packaging team. You will develop comprehensive thermal and electrical simulations for next-generation semiconductor packaging solutions, including 2.5D/3D IC integration, chiplet-based systems, and advanced heterogeneous integration technologies. This role is critical in enabling high-performance computing, AI accelerators, and advanced chiplet architectures. We offer a fun work environment with excellent benefits. ONSITE M-F
Skills
PythonMachine Learning
