Senior Applications Engineer – Semiconductor 3D X-ray Solutions

Key Responsibilities

through in-depth understanding of customer technologies and critical gaps and work throughout the work cycle until the implementation of the solution

Technically leads difficult, complex application activities and team

Leads the execution teams ß-sites, evaluation and demos at customers site, through high involvement in the SOW and commitment schedule

Interfaces with the customer regarding technical requirements analysis and schedule

Define/approve Product application support plans for installation

Create & Lead new methodologies in order to optimized system performance for specific application

Analysis, Develop and Transfer new application capabilities in the system envelope from product division to customer application support team

Lead customer Technical review meetings

Functional Knowledge

• Demonstrates conceptual and practical expertise in own discipline and basic knowledge of related disciplines

Business Expertise

• Has knowledge of best practices and how own area integrates with others; is aware of the competition and the factors that differentiate them in the market

Leadership

• Acts as a resource for colleagues with less experience; may lead small projects with manageable risks and resource requirements

Problem Solving

• Solves complex problems; takes a new perspective on existing solutions; exercises judgment based on the analysis of multiple sources of information

Impact

• Impacts a range of customer, operational, project or service activities within own team and other related teams; works within broad guidelines and policies

Interpersonal Skills

• Explains difficult or sensitive information; works to build consensus

Senior Applications Engineer – Semiconductor 3D X-ray Solutions

As an Applications Engineer, you will join an exciting and growing team of scientists, engineers, and research professionals, focused on advancing 3D X-ray solutions for semiconductor applications. You will collaborate closely with customers and internal teams to enable cutting-edge inspection, metrology, and failure analysis workflows.

Key Responsibilities

• Lead system demonstrations for semiconductor customers, including fabs, FA labs, and R&D centers
• Develop new applications and methodologies tailored to semiconductor devices, processes, and packaging technologies
• Provide critical input to product development by informing system specifications based on customer needs and application gaps
• Deliver advanced customer training on system operation, data acquisition, and analysis workflows
• Design, develop, and optimize robust workflows for semiconductor inspection and analysis
• Perform tool characterization, benchmarking, and baseline performance studies for semiconductor use cases
• Serve as a technical leader in customer-facing support activities, including:
• Delivering high-impact technical presentations and demos
• Supporting industry conferences and trade shows
• Authoring technical papers and presenting at conferences

Customer Base

Our customers include semiconductor manufacturing facilities (fabs), failure analysis (FA) laboratories, and advanced R&D organizations working at the forefront of device innovation.

Role Impact

In this role, you will act as a key technical interface between engineering, sales, and marketing, serving as the voice of the semiconductor customer. You will partner with external clients and internal development teams to:

• Establish best-in-class workflows for routine semiconductor inspection and analysis
• Identify and unlock new applications of 3D X-ray technology across front-end and back-end processes
• Solve high-value problems (HVPs) related to yield, reliability, process development, and advanced packaging

Essential Qualifications

• BS or MS degree in a relevant technical field (e.g., Materials Science, Physics, Electrical Engineering, or related discipline)
• 3–5 years of experience in a semiconductor-related field (e.g., fabs, failure analysis, metrology, or process development)
• Hands-on experience designing experiments, analyzing data, and delivering results in a commercial or customer-facing environment
• Ability and willingness to travel up to 30% (domestic and international)

Preferred Qualifications

• Background in microscopy or advanced imaging techniques (e.g., X-ray CT, SEM, FIB)
• Working knowledge of X-ray absorption principles and imaging/optical fundamentals
• Experience with semiconductor capital equipment, particularly in inspection, metrology, or FA workflows
• Familiarity with advanced semiconductor technologies (e.g., 3D IC, heterogeneous integration, advanced packaging)

## Qualifications

### Education:

Bachelor's Degree

### Skills

### Certifications:

### Languages:

### Years of Experience:

2 - 4 Years

### Work Experience:

## Additional Information

###

### Shift:

10-Day 8-Hr (United States of America)

###

### Travel:

Yes, 25% of the Time

###

### Relocation Eligible:

No

### Referral Payment Plan:

Employee Referral (Standard)

U.S. Salary Range:

$108,000.00 - $148,500.00

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.