- Location
- Kuala Lumpur, Malaysia
- Type
- Full-time
- Department
- Engineering
- Seniority
- Senior
- Source
- Workday
Description
- Utilize a wide variety of sample preparation techniques and imaging tools, including but not limited to chemical processing, die extraction, die physical polishing, RIE, MIP, X-Prep, cross-sectioning, wire bonding, repackaging, ion polishing, SEM/EDX, and backside IR.
- Operate precision milling/polishing systems and Reactive Ion Etching (RIE) systems for high-precision, site-specific sample preparation for package-level electrical FA (EFA) and die-level physical FA (PFA).
- Perform die extraction for various package types and execute layer-by-layer polishing at the die level.
- Conduct sample preparation through grinding/polishing, chemical processing, and repackaging techniques.
- Document analysis results thoroughly, including detailed observations, conclusions, and recommended corrective actions.
- Contribute to the development of new FA techniques, methodologies, and recipes, as well as tool evaluation projects to support emerging technologies.
- Demonstrate a strong understanding of semiconductor manufacturing processes.
Job Qualifications
- Bachelor’s or Master’s degree in Materials Science, Physics, Analytical Chemistry, or a related field.
- Proven experience (3+ years) in a semiconductor manufacturing or R&D environment; Wafer Fab experience is a plus.
- Hands-on experience with a broad range of FA sample preparation tools and techniques.
- Strong theoretical and practical knowledge of semiconductor device processing and packaging technologies.
Skills
SEM