ENGINEER, MTB PQA LAB

Req. ID:

JR113935 ENGINEER, MTB PQA LAB

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

## Job Summary

We are seeking a highly motivated Failure Analysis Engineer to join our Product Failure Analysis (PFA) Laboratory. The successful candidate will be responsible for conducting failure analysis, root cause investigations, and advanced package characterization to support product development and yield improvement.

This role requires strong analytical skills, hands-on laboratory experience, and the ability to collaborate with cross-functional teams in a fast-paced semiconductor environment.

## Qualifications

### Education

Bachelor's or Master's degree in:

• Materials Science & Engineering
• Electrical Engineering
• Electronics Engineering
• Mechanical Engineering
• Chemical Engineering
• Physics, Chemistry, or related technical disciplines

Experience in one or more of the following areas is preferred:

• Wafer Fabrication
• Assembly and Packaging
• Product Engineering
• Yield Enhancement
• Failure Analysis Laboratory
• Advanced Packaging Technologies

## Responsibilities

• Perform electrical and physical failure analysis of semiconductor devices and packages.
• Conduct root cause investigations and provide technical recommendations.
• Develop and execute analytical plans to support engineering requests.
• Interpret analytical results and communicate findings effectively.
• Collaborate with Process, Product, Quality, Reliability, and Manufacturing teams.
• Generate technical reports and present findings to stakeholders.
• Support urgent customer and production-related failure analysis activities.

## Preferred Technical Skills

Experience in one or more of the following:

### Failure Analysis Techniques

• Fault Isolation (FI)
• Voltage Contrast (VC)
• Delayer / Deprocessing
• Cross-section Analysis
• Die-level Failure Analysis
• Root Cause Analysis

### Equipment Experience

• FIB (Focused Ion Beam)
• SEM / EDS
• 3D X-ray / CT
• CSAM
• Optical Microscopy
• Hot Spot Analysis
• Emission Microscopy (EMMI)
• OBIRCH
• PHEMOS
• Sample Preparation Equipment

## Preferred Experience

Candidates with experience in the following areas are highly desirable:

• HBM Failure Analysis
• Advanced Packaging Technologies
• TSV Analysis
• Micro-bump Inspection
• Hybrid Bonding Characterization
• Die Crack Analysis
• Delamination Investigation
• Thermal Failure Analysis
• Material Characterization

## Soft Skills

• Strong problem-solving and analytical skills
• Self-motivated and fast learner
• Ability to work independently and drive tasks to completion
• Strong communication and presentation skills
• Effective collaboration across global and cross-functional teams
• Ability to manage multiple priorities in a dynamic environment

## Nice to Have

• Experience with Python, JMP, Power BI, or data analytics tools
• Knowledge of HBM, 2.5D/3D packaging, or advanced packaging technologies
• Experience supporting new technology node development and qualification
• Technical report writing and presentation experience in English

### AI & Digital Skills (Preferred)

• Leverage AI-assisted tools and digital solutions to improve failure analysis efficiency, data interpretation, and technical decision-making.
• Apply data analytics, automation, and AI-enabled workflows to accelerate root cause investigation and problem-solving activities.
• Utilize AI-based tools to enhance technical reporting, knowledge management, and process optimization.
• Demonstrate a data-driven mindset with the ability to identify opportunities for workflow automation and productivity improvement.
• Experience with Python, JMP, Power BI, SQL, machine learning, or AI-assisted engineering tools is a plus.

Job Profile(s):

Quality Engineer 1 - Quality Engineer 2

Relocation level: (TBD)

Before Getting Started

Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that:

• Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.
• If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.

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As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.