Senior Product & Test Engineer, RF & Mixed-Signal Semiconductors

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Company:

Qualcomm Global Trading Pte. Ltd.

## Job Area:

Engineering Group, Engineering Group > Hardware Engineering

General Summary:

About Qualcomm

Qualcomm is the world's leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries — including automotive, the Internet of Things, and computing — and are leading the way to a world where everything and everyone can communicate and interact seamlessly.

Job Responsibilities

• Drive product and test development from pre-silicon to mass production, including test hardware and software development, characterization plan development, and design IP characterization.
• Lead first silicon debug, process experiment (DOE) definition, multiple-source fab matching, and guard band / test limit generation.
• Drive short-term and long-term test time reduction (TTR) and yield improvement initiatives to meet defined targets without compromising production quality — including the use of AI-driven optimization techniques.
• Leverage AI-assisted data analytics and machine learning tools to accelerate yield variance control, outlier detection across large production datasets, parametric limit setting, and engineering documentation workflows.
• Manage multiple projects in parallel, balancing NPI milestones and sustaining commitments while driving data-driven decisions in collaboration with local and remote teams.

Preferred Qualifications

• Knowledge of semiconductor manufacturing processes and wafer fabrication fundamentals.
• Solid understanding of electronics engineering fundamentals — digital, analog, mixed-signal, power management, and RF circuit analysis techniques.
• Knowledge of RF transceiver design for cellular applications and design verification of RF chips; familiarity with test methodologies including Noise Figure, RF Matching, Gain, IP2/IP3, RSB, ACLR, Phase Noise, etc.

• Basic understanding of ASIC device-level characterization; system level knowledge, prior lab or internship experience is a plus.

• Hands-on experience with statistical analysis software, quality and reliability testing, and Six Sigma / Statistical Process Control (SPC) techniques.
• Comfortable working with lab equipment such as Oscilloscopes, Source Meters, Battery Emulators, Spectrum Analyzers, etc.
• Familiarity with AI-assisted engineering platforms or LLM-based tools for diagnostics, code generation, or documentation is a plus.
• Ability to work independently with strong initiative, overcome technical challenges, and present data-driven decisions effectively to cross-functional and leadership teams.
• Strong verbal and written communication skills, with the ability to organize and document work thoroughly across distributed teams.

Educational Requirements

• Bachelor's degree in Electrical and Electronics Engineering required. Master’s degree or Electrical Engineering related experience work experience is preferred.

Minimum Qualifications:

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.

OR

Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience.

OR

PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.

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