Senior High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer

Req. ID:

JR98298 Senior High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer

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Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Job Description

As a Global Quality (GQ) High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer on the DRAM/Emerging Memory Quality and Reliability Assurance team (DEMQRA) at Micron Technology, Inc., you will be responsible for the electrical characterization and electrical failure analysis (EFA) of all HBM products. You will need to distinguish whether it is package or device related failures. Preferably, you are equipped with knowledge of DRAM functionality, process, test program and device necessary for making solid judgment. You will also use a variety of test tools including the uMate tester, Merlin, Mongoose SM3, Prober, CAD layout tool, and a variety of technical drawings and schematics to perform detailed characterization on HBM products. You will record and categorize failures in order to determine failure mechanisms and characteristics. In this role, you will communicate with various engineering groups, assist lab users with equipment setup and interpretation of data, and maintain critical EFA knowledge database. You will also be expected to seek ways to improve the EFA process in order to reduce test time, increase throughput, and increase failure mechanism assignment accuracy and consistency.

You will:

Analyze Failed Components from Reliability Testing

• Interpret historical tests results
• Adjust timing/level/testmode/code/temp to find out the sensitivities of failures for array fails
• Perform visual inspection to identify physical defects
• Utilize schematics/layouts/process to recognize abnormalities
• Document failed conditions and test results
• Categorize electrical failures
• Communicate results
• Coordinate next level analysis to various groups including PYE (Product Yield Enhancement) for CSAM (C-mode scanning acoustic microscope)/functional open (FO)/PFA (Physical Failure Analysis), Product Engineering and Package Reliability.
• Identify and communicate new or unusual results (electrical signals)

Respond to Equipment Issues

• Understand test software and hardware configurations
• Troubleshoot hardware issues
• Identify and report software and hardware issues
• Repair or coordinate repair of equipment
• Configure and upgrade test equipment
• Develop and deploy failure analysis (FA) software

Provide Technical Support and Conduct Training

• Assist lab users with equipment setup
• Teach operation of equipment
• Conduct on-the-job training (OJT) for new hires and transfers
• Provide data interpretation
• Suggest failure root cause
• Provide suggestions for further analysis
• Introduce new users to basic DRAM functionality/process/device

Perform Engineering Requests and Supplemental Tasks

• Submit package level physical failure analysis (PFA)
• Provide FA for other groups as requested (RMA, Module)
• Determine engineering test requirements
• Execute request and experiments
• Summarize test results and provide feedback
• Create repair converters

Manage Failure Analysis (FA) Information

• Create and maintain specific FA database
• Track FA data
• Identify false failures
• Analyze and summarize data

Perform Quality/Reliability request and review

• Perform review on test time reduction requests
• Perform review on Design/Marketing datasheet requests
• Perform review on Modify Qual requests
• Perform review on Material Review Board (MRB)
• Perform review on Process of Record Review Board (PORRB)
• Perform review on customer reports/data

Education:

• Required: Bachelor’s degree in Electrical / Electronics/ Computer Engineering
• Desired: Master’s Degree in Electrical / Electronics/ Computer Engineering

Required Qualifications:

• 5+ years of experience in semiconductor field
• Knowledge of DRAM operation, fabrication process and semiconductor device physics
• Familiarity with failure analysis, troubleshooting/debugging, advanced packaging, wafer testing, component testing and module testing concept and flow.
• Strong troubleshooting skill
• Good organizational skills and sharp attention to detail
• Good written and oral communication skills
• Efficient computer skills
• Knowledge of the DRAM fabrication process/test program/functionality
• Familiarity with Unix, DFII/Cadence, and/or uMate preferred
• Ability to work independently or in a group environment
• Basic understanding of electrical equipment
• Ability to use the analytical tools provided on the various test equipment, such as uMate, Curve Tracer, or Oscilloscope

Job Profile(s):

Quality Engineer 3

Relocation level: (TBD)

Before Getting Started

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As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.