Low Power Analog-Mixed Signal Technologist, Senior Director

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Company:

Qualcomm Technologies, Inc.

## Job Area:

Engineering Group, Engineering Group > ASICS Engineering

General Summary:

The Senior Director of Low Power Analog & Mixed-Signal Technologist will serve as the key technology and organizational leader responsible for defining and executing the long-term strategy for advanced sensing, mixed-signal semiconductor platforms, and intelligent edge systems. This leader will drive innovation and product differentiation across Robotics, Extended Reality (XR), Industrial IoT (IIoT), Intelligent Sensors, and AI-enabled embedded platforms.

The role requires a unique combination of deep technical expertise, executive leadership, business acumen, and cross-functional influence. The successful candidate will work with multiple engineering organizations and senior technical leaders while shaping technology roadmaps, investment priorities, ecosystem partnerships, and multi-generation platform strategies.

This position will play a critical role in developing technologies for next-generation sensor ASIC IP, mixed-signal subsystems, intelligent sensing architectures, and edge AI platforms, while ensuring alignment between technical execution, customer requirements, and business objectives.

Qualifications

• Ph.D. in Electrical Engineering, Computer Engineering, or related discipline with 10+ years of relevant industry experience

OR

• M.S. in Electrical Engineering, Computer Engineering, or related discipline with 14+ years of relevant industry experience

Additionally:

• Proven experience leading large engineering organizations consisting of directors, managers, architects, and senior technical contributors.
• Extensive expertise in low-power analog, mixed-signal, sensor, and semiconductor system architecture.
• Demonstrated success defining and delivering complex semiconductor products from concept to high-volume production.
• Experience leading global cross-functional teams spanning silicon development (pre/post bringup), firmware, software, validation, packaging, manufacturing, and product engineering.
• Strong track record of driving technology strategy, technical innovation, and organizational transformation.
• Experience managing external partners, technology suppliers, foundries, IP providers, and strategic ecosystem relationships.
• Demonstrated ability to influence executive leadership and business stakeholders through technology vision and execution excellence.

Leadership and Technical Responsibilities

Technology Strategy and Vision

• Define and own the long-term technology roadmap for low-power analog, mixed-signal, sensing, and intelligent edge computing platforms.
• Drive technology planning for Robotics, XR, Industrial Automation, Intelligent Sensors, and Edge AI applications.

Organizational Leadership

• Build a high-performance engineering culture focused on innovation, execution excellence, technical rigor, and continuous learning.
• Foster collaboration across global cross-functional engineering organizations and external technology partners.
• Drive engineering process improvements, quality initiatives, and operational excellence across the organization.
• Mentor senior technical teams across systems engineering, platform integration, and architecture execution.

Technical Leadership

• Provide executive oversight of system architecture across sensing, mixed-signal ICs, AI processing, embedded software, communication interfaces, packaging, and system integration.
• Guide architecture tradeoffs involving power, performance, scalability, latency, reliability, safety, security, and cost.
• Lead technology review boards and critical architecture decision forums.
• Drive development of platform architectures that enable reusable technologies across multiple product families and business segments.
• Champion innovation through patents, publications, strategic research initiatives, and industry engagement.

Ecosystem and Industry Leadership

• Build strategic relationships with customers, suppliers, foundries, technology partners, universities, and research organizations.
• Drive external collaborations that accelerate innovation and product differentiation.

Principal Duties and Responsibilities

Program Leadership

• Oversee a portfolio of mixed-signal, sensor, and intelligent edge technology programs spanning multiple product generations.
• Align technology roadmaps with business requirements, customer needs, and market opportunities.
• Establish execution frameworks, milestones, and risk mitigation plans for key development programs.
• Ensure successful program delivery from concept initiation through commercialization and production ramp.

Advanced Semiconductor Platform Development

• Direct development of advanced mixed-signal technologies such as Analog Front Ends (AFEs), ADCs and DACs, Low-Power Sensor Interfaces, Timing and Synch/Asynch Architectures, Power Management IP, Sensor Fusion Platforms, Intelligent Edge Processing Architectures, AI-Enabled Sensor Systems.
• Guide architecture and implementation decisions involving CMOS technologies, heterogeneous integration, advanced packaging, chiplets, and system-in-package solutions.
• Ensure product reliability, manufacturability, yield optimization, and cost effectiveness throughout the development lifecycle.

Robotics and Intelligent Sensing Leadership

• Define technology strategies for tactile sensing, multi-modal sensing, robot perception, autonomous systems, and intelligent control platforms.
• Drive integration of advanced sensor technologies with AI, machine learning, and robotics software frameworks.
• Establish scalable platform strategies that support multiple generations of robotics and intelligent edge products.
• Enable differentiation through innovative sensing architectures and intelligent processing solutions and new sensing device designs in collaboration with process tech team.

Business Impact and Execution

• Influence product strategy, commercialization plans, customer engagements, and investment priorities.
• Drive measurable business outcomes through technology leadership and execution excellence.

Minimum Qualifications:

• Bachelor's degree in Science, Engineering, or related field and 10+ years of ASIC design, verification, validation, integration, or related work experience.

OR

Master's degree in Science, Engineering, or related field and 9+ years of ASIC design, verification, validation, integration, or related work experience.

OR

PhD in Science, Engineering, or related field and 8+ years of ASIC design, verification, validation, integration, or related work experience.

Preferred Qualifications

• PhD Degree in Engineering, Information Systems, Computer Science or related field.
• 15+ years of ASIC design and Systems Engineering or related work experience.
• 15+ years of analog mixed signal domain expertise with low power designs.
• 4+ years of experience working in a large matrixed organization.
• 4+ years of supervisory experience.
• 3+ years of work experience in a role requiring interaction with executive leadership (e.g., Vice President level and above).
• 2+ years of working with operating budgets and/or project financials.
• Experience leading semiconductor or system organizations focused on Robotics, XR, Industrial Automation, AI, or Intelligent Edge Computing.
• Deep understanding of edge AI architectures, sensor fusion algorithms, machine learning systems, and autonomous platforms.
• Knowledge of functional safety, reliability engineering, cybersecurity, and mission-critical embedded systems.
• Experience leading development of custom ASICs, sensor platforms, SoCs, or large-scale semiconductor portfolios.

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Pay range and Other Compensation & Benefits:

$249,900.00 - $374,900.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.

If you would like more information about this role, please contact Qualcomm Careers.