Staff Package Design Engineer- experienced in package development of power SiP/module
Renesas Electronics
·Jun 16, 2026
- Location
- Zhubei, Taiwan
- Workplace
- Onsite
- Type
- Full-time
- Department
- Manufacturing
- Seniority
- Mid-Senior Level
- Experience
- 6+ years
- Education
- PhD
- Industry
- Semiconductors
- Category
- Engineering
- Role type
- Individual Contributor
- Environment
- Industrial
- Source
- SmartRecruiters
Overview
As a Package Design Engineer at Renesas, you'll focus on developing packaging methods for power SiP/modules, wafer-level, and flip-chip technologies. You'll work with subcontractors to optimize processes, ensure quality, and support product groups. This role requires strong technical knowledge in packaging, materials, and process development. You'll also contribute to roadmap planning and resolve customer issues.
Skills
Agile
Languages
English
About Renesas Electronics
Renesas Electronics is a global semiconductor company focused on making the world safer, healthier, and smarter through embedded processing solutions.
