- Location
- Malacca, Malacca,MY, MY
- Type
- Internship
- Department
- IT
- Seniority
- Internship
- Education
- Bachelor
- Source
- Eightfold
Description
Internship under Unit Process Development Your role Key responsibilities in your new role Support Engineer to run DOE on die clip attach process. Perform data collection and analysis of the DOE. Your profile Qualifications and skills to help you succeed Bachelor Degree in Engineering or any other related field. Minimum CGPA of 3.00 and above. Minimum 3 months of internship. Good analytical, problem-solving and communication skills Demonstrates knowledge in semiconductor industry. Demonstrates interest to learn new technology and tools #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon. Shanice Goh [email protected]
