Sr. Assembly TD Engineer: Advance PKG stacking

Req. ID:

JR106292 Sr. Assembly TD Engineer: Advance PKG stacking

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Job Description:

A senior advanced assembly technology development engineer is responsible for introducing new technology to enable next generation packaging. This position engaged latest stacking/flip chip technology, advance packaging material and work on new process set up, process/ packaging characterization and process transfer from TD phase to high volume production to meet development milestone. This position required high motivation and operation skill to build DOE sample and fulfill customer requirement sample as well as cooperate with Material engineer, Bumping, PI, NPI, quality and manufacturing team to ensure process transfer successfully.

Responsibilities

• Explore new technology on semiconductor industry such as flip chip, TCB and hybrid bonding process equipment and packaging material.
• Provide plan and resource requirement to enable new technology.
• Set up DOE plan and execute.
• Build sample and perform data analysis skill.
• Lead efficiency trouble shooting skill to improve process.
• Prepare documentation for process transfer from TD to HVM
• Review process stability by FDC, SPC and test result.
• Self-motivated and capable of working independently, proactively identifying opportunities and driving projects with minimal direction.
• Demonstrated ability to manage multiple technical challenges, prioritize tasks effectively, and deliver results in a fast-paced development environment.
• Applying AI, data analytics, and automation tools to accelerate process development, yield improvement, failure analysis, and technical decision-making.

Requirement

• Hands-on experience in Flip chip, TCB or hybrid bonding process ( wet processing, surface cleaning, plasma surface activation/treatment, or plasma-based dry etching processes) development, process integration, or advanced packaging technologies is preferred.
• Strong technical problem-solving and data analysis skill.
• Open mindset to introduce new technology and process development.
• Above 3 years experience on Assembly process.
• Fluent in English communication.
• Excellent communication skill.
• Master degree in engineering as material science, mechanical, chemical engineering or physics and chemistry.

Job Profile(s):

Product Development Engineer 2 - Product Development Engineer 3

Relocation level: (TBD)

Before Getting Started

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As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.