- Location
- Taichung City,TW, TW
- Type
- Full-time
- Education
- PhD
- Source
- Eightfold
Description
Ensure smooth transition from new process development, 1st qualification success to small volume production launch Development and Qualification of new packaging process, material, equipment and technology solutions to meet new Technode requirements and schedule Perform CPI NUDD, process TRA, risk mitigation execution and process recipe readiness prior Silicon arrives and ensure 1st pass rate. Provide new solutions on time to meet company and customer needs PhD/Masters/Bachelor's Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required 8 years' experience in semiconductor industry Experience in Frontend fab Process integration or Module process with technical knowledge on wafer and die level process technology Strong project management skills to ensure execution to timelines Strong communication and presentation skills Understanding of business needs and customers' requirement Ability to integrate & cooperate with people from cross function teams