- Location
- Taiwan-Hsinchu-Puding Road
- Type
- Full-time
- Department
- Engineering
- Closing date
- Today
- Source
- Workday
Description
Please Note:
1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)
2. If you already have a Candidate Account, please Sign-In before you apply.
Job Description:
Responsible for working with Broadcom substrate subcontractors to manage and resolve issue relating to packaging, manufacturing, yield, quality, and delivery of high volume semiconductor devices.
Responsible for NPI activities, risk assessment, process improvement and development and production engineering support of high volume IC substrate manufacturing.
Wok with Broadcom internal cross functional engineering team resolves issues with interactive nature, work on newly developed packaging technology and drive towards high volume manufacturing maturity.
Responsible for new product pre-production engineering activities and drive improvement in process and visual mechanical yields, cycle time\
Take on site standardization in Best Known Methods, and verification on compliance toward Broadcom requirement.
Drive capability enhancement and cost reduction projects
Qualification of new substrate suppliers and support for moving to HVM
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.