Senior Field Applications Engineer

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Job Description:

Microchip Technology is seeking an experienced Field Applications Engineer to serve as the principal technical interface between the Company, its customers, distribution partners, the sales organisation and the Business Units across the India region. The successful candidate will drive design wins and revenue growth across the Power Electronics portfolio, and will be expected to develop a working knowledge of the Company’s wider offering — Analog, Timing, and the 8-, 16- and 32-bit microcontroller and digital signal controller families, together with the RF power portfolio, which is a separate discipline in its own right — so as to position complete, system-level solutions rather than discrete component sales.

The primary role of the Field Applications Engineer is to support the customer technically throughout the design cycle and, in particular, during validation and qualification and the release of the design into volume production. Early engagement secures the design win; revenue is realised only once the design is qualified and in mass manufacture. The candidate is therefore expected to remain engaged and accountable at every stage — resolving qualification findings, supporting the production ramp and sustaining the design after release.

Principal Responsibilities

Design-Win Generation and Revenue Growth

• Identify, develop and convert design opportunities across the Power Electronics portfolio in line with regional design-win and revenue targets, maintaining an accurate pipeline with Sales and Distribution.
• Analyse customer system requirements and recommend the optimal Microchip solution set — power management devices, silicon and silicon carbide discretes and modules, gate drivers and isolated gate drivers, sensing, controllers, and complementary Analog and Timing products.

Technical Support Across the Design Cycle

Support shall be sustained and hands-on at every phase. Validation, qualification and production release constitute the primary focus of the role; engagement continues until the design is in stable volume manufacture and thereafter for sustaining support.

• Concept to schematic — topology selection, system partitioning, feasibility assessment, device sizing and derating, bill-of-materials proposal, control-loop and compensation review, protection and power-sequencing review.
• PCB layout — power-stage layout, grounding and return-path strategy, thermal- and EMI-aware component placement.
• Prototype bring-up and optimisation — laboratory support, first power-up, fault diagnosis, and improvement of efficiency, thermal performance, EMI/EMC, transient response and reliability.
• Validation and qualification (primary focus) — review of the design-verification and qualification test plan; guidance on corner-case, margin, life and stress testing across voltage, load, temperature and line; EMI/EMC pre-compliance and safety pre-screening; and joint root-cause analysis of qualification failures with the Business Unit.
• Production release and ramp (primary focus) — design-for-manufacture and design-for-test review, pilot-run and line bring-up, resolution of production test and programming issues, yield analysis, field-return and failure analysis, lifecycle and supply-continuity guidance, and sustaining support.

Application Domain Coverage

The role spans two distinct technical domains. Switch-mode power conversion is the core of the position; RF power is a separate portfolio and a separate engineering discipline, and the two are not interchangeable.

Switch-mode power conversion and motor control

• DC-DC converters (buck, boost, buck-boost, four-switch buck-boost) and isolated topologies (flyback, forward, LLC resonant, phase-shifted full bridge, CLLC).
• AC-DC supplies and power factor correction; battery-powered systems, chargers and battery management.
• Motor control drives — BLDC, PMSM and ACIM, sensored and sensorless — and industrial, automotive and embedded power sub-systems.

RF power

• GaN-on-SiC HEMT RF power transistors, RF power MOSFETs, MMIC power amplifiers.
• Amplifier-stage support — device selection for pulsed and continuous-wave duty, output power, gain, efficiency and linearity trade-offs, impedance matching and pallet integration, VSWR ruggedness, pulse fidelity and droop, and thermal design.

Silicon Carbide and Wide Bandgap Solutions

Silicon carbide is a strategic growth area within the portfolio. The candidate will promote and technically support the Company’s SiC MOSFETs, Schottky barrier diodes, power modules and associated gate drivers, covering:

• Device selection and sizing, including comparison against silicon alternatives on efficiency, switching frequency, thermal performance, system cost and solution size.
• Gate-drive design for wide bandgap devices — drive voltage and impedance, negative turn-off bias, isolation and common-mode transient immunity, gate-loop layout — with protection covering short-circuit withstand, desaturation detection and soft shut-down.
• Management of high dv/dt and di/dt, parasitic inductance, overshoot and ringing, and the resulting EMI and insulation stress; thermal design, module packaging and device paralleling.
• Application support for silicon-carbide systems — solar and energy-storage inverters, bidirectional converters, electric-vehicle on-board chargers and DC fast charging, traction and industrial drives.

Collaboration with Microcontroller and Digital Signal Controller Teams

Many power designs are completed only in combination with an embedded controller. The candidate will work closely and routinely with the internal teams responsible for the 8-, 16- and 32-bit microcontroller and digital signal controller families — the relevant Business Units, applications engineering groups and firmware development teams — to deliver a complete hardware-plus-firmware solution.

• Engage those teams early in the opportunity, so that controller selection, peripheral capability and software availability are established alongside the power-stage architecture rather than after it.
• Support customer adoption of Microchip controller platforms with their development tools, software frameworks, control libraries and reference firmware, and give first-level guidance on control-loop implementation, ADC, PWM, comparator and timer configuration, and firmware-hardware co-debug.
• Act as the technical bridge between the customer’s power-hardware and firmware teams and the Company’s internal firmware resources; attach controller content to power opportunities and feed customer requirements and gaps back to the responsible Business Units.

Technical Presentations, Training and Seminars

• Deliver technical presentations, roadmap briefings, solution pitches and design reviews to customer engineering and management audiences, on site and remotely.
• Plan and conduct customer and distributor training — classroom and hands-on workshops covering Microchip devices, reference designs, development boards, software tools and laboratory exercises.
• Represent the Company as a technical speaker at seminars, webinars, roadshows, technology days, exhibitions, industry conferences and academic engagements, addressing audiences from a single design team to several hundred attendees.
• Prepare and maintain the supporting material — presentation decks, application notes, block diagrams, demonstration set-ups and training content — keeping it current with the product roadmap.

Cross-Functional and Competitive Engagement

• Collaborate with Sales, distribution partners, the Analog and Power, silicon carbide and controller Business Units, and factory applications teams to resolve technical escalations and secure design-win objectives.
• Monitor industry trends, emerging standards and competitive offerings; provide structured competitive positioning and feedback to the Business Units to influence roadmap direction.

Requirements/Qualifications:

Technical Competencies — Essential

• Sound command of power electronics fundamentals and switching power supply design theory.
• Demonstrated hands-on design or support experience in one or more of: non-isolated DC-DC converters (buck, boost, buck-boost); isolated converters (flyback, forward); AC-DC power supplies; battery-powered systems; motor control applications.
• Working familiarity with power MOSFET and gate driver selection and gate-drive circuit design; power management integrated circuits; analog circuit design including signal conditioning and current sensing; feedback loop design and compensation; EMI/EMC fundamentals and mitigation; and thermal management.
• Familiarity with RF power as a discipline separate from switch-mode power conversion — RF power transistors and amplifier stages, their pulsed and continuous-wave ratings, gain, efficiency and linearity trade-offs, bias arrangements and sequencing, load mismatch ruggedness, and thermal design. Full RF system, transceiver or antenna design expertise is not required.
• Proven competence with laboratory instrumentation — oscilloscopes, power analysers, electronic loads, function generators and programmable DC supplies.

Education, Experience and Professional Attributes

• Diploma, Bachelor’s or Master’s degree in Electrical, Electronics, Electrical & Electronics, or Power Electronics Engineering.
• Minimum five (5) years of relevant experience in power electronics design, switch-mode power supply development, hardware design, application engineering, technical support or field applications engineering.
• Strong analytical and structured troubleshooting capability, with excellent written and verbal communication skills.
• Demonstrated ability to prepare and deliver technical presentations, training sessions and seminars, and to present confidently to both engineering and management audiences, including larger public forums.
• Ability to work independently across multiple concurrent customer engagements within a cross-functional, multi-site organisation, and willingness to travel within the region for customer visits, technical support and training.

Preferred Qualifications

• Exposure to advanced and higher-power topologies — LLC resonant, phase-shifted full bridge, power factor correction (continuous-conduction, interleaved, bridgeless) and bidirectional converters.
• Understanding of wide bandgap device technology, including gate-drive requirements, switching behaviour, protection needs and trade-offs against silicon; direct experience with silicon carbide MOSFETs, diodes or modules is an advantage.
• Experience with digital power control and digitally controlled motor drives, including embedded C and microcontroller peripheral configuration sufficient for application-level firmware debug.
• Practical experience with electronic circuit simulation — SPICE-based analogue and power-stage or control-loop modelling used to validate a design ahead of hardware build.
• Working knowledge of electronic design automation tools for schematic capture and PCB layout (Altium Designer, OrCAD/Allegro, Cadence, Mentor/Siemens, KiCad or equivalent), with the ability to review customer schematics and layouts and report findings.
• Hands-on experience in RF power amplifier design or application support is a distinct advantage — pulsed radar, avionics or industrial RF stages, matching and load-pull characterisation, pulse droop and bias sequencing, and the high-voltage drain supplies (typically 50 V to 300 V) used by kilowatt-class stages.
• Good working knowledge of the Analog and Timing product categories, sufficient to identify complementary opportunities and provide first-level application support.
• Familiarity with regional and international standards applicable to industrial, automotive or energy-sector power equipment.

Measures of Success

• Achievement of assigned design-win and revenue targets, including growth of silicon carbide activity in the territory.
• Conversion of supported design wins into qualified designs released to volume production, the time taken to get there, and timely closure of qualification findings and production issues.
• Attachment of complementary Analog, Timing, RF power and controller content; reach of training and seminars delivered.

Microchip Technology is an equal opportunity employer.

Travel Time:

0% - 25%

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