Manufacturing Operations Technical Programme Manager – Silicon and Packaging

About Fractile

Fractile was founded in 2022 on the bet that, eventually, the world’s most capable AI systems would be limited in their impact by the time taken to produce useful outputs. We bet everything on the logical conclusion: that the only way to truly unlock this latent value, to make speed viable at scale, was to radically re-invent the hardware that we run our frontier AI models on. Ever since, we have been building chips and systems that tackle this problem: how to efficiently generate output at thousands of tokens per second, while handling the complexity and capacity challenges of operating large models at very long contexts.

The workloads that push to the limits of the current frontier are already transformational; it is the technical and economic limits on inference speed that are constraining progress. The defining work of the 21st century will be marked by the engine of inference delivering immense and diffuse chains of intellectual inquiry, in drug discovery, in software engineering, in materials discovery, in any field where progress is driven by deep reasoning and intelligence to resolve complex problems. 

Manufacturing Operations Technical Programme Manager – Silicon and Packaging 

Reporting into the Director of Programmes, the Manufacturing Operations Technical Programme Manager will manage the silicon production, packaging design, packaging manufacturing, and delivery flow through to our contract manufacturer.  

This role will act as the key interface between Fractile, the foundry, OSAT partner and the internal operations team, ensuring that technical milestones, schedules, risks, and handoffs are tightly managed from wafer production through to packaged silicon delivery. 

What You’ll Do 

Hardware Programme Delivery 

• Own the end-to-end project plan from wafer production through packaged silicon delivery 

• Coordinate day-to-day activity with foundry, OSAT, packaging, logistics, and contract manufacturing partners. 

• Track milestones across wafer starts, fab progress, packaging, assembly, final test, qualification, and shipment. 

• Manage risks, dependencies, schedule changes, and timely issue resolution, working closely with team leads and programme managers for silicon, hardware systems and hardware test internally and external partners and suppliers 

• Ensure manufacturing documentation, test requirements, quality requirements, and build readiness materials are complete 

• Support NPI, prototype builds, qualification, and production ramp 

• Lead manufacturing operations programme reviews that surface risk early and clearly and contribute to overall programme portfolio reviews 

In addition, you will contribute to the development of the Programmes Team:  

• Contribute to the design and rollout of scalable programme management practices across Fractile, covering planning, forecasting, reporting, risk and change control 

• Bring proven patterns from previous environments and adapt them to our development stage, pace and constraints rather than importing process for its own sake 

• Help establish shared tooling, templates and review cadences that work consistently across silicon, hardware, manufacturing and software workstreams 

What We’re Looking For 

Experience: 

• 5+ years in technical project management, operations, supply chain, or programme management in semiconductors or complex hardware 

• Experience working with foundries, OSATs, packaging suppliers, or contract manufacturers 

• Strong understanding of semiconductor production and packaging flows 

• Ability to manage complex schedules, multiple stakeholders, technical dependencies, supplier risks, and cross-functional execution. 

• Experience using tools such as Jira, Confluence, Linear, Asana, Smartsheet, MS Project or PLM systems 

• Experience working in a rapidly scaling organisation building process on the way 

• Experience in the following areas would be an advantage: 

• Advanced packaging, high-performance compute, chiplets, 2.5D/3D integration, or HBM-based packages. 

• Familiarity with silicon bring-up, NPI, qualification, yield tracking, and production ramp. 

• Working with Asian semiconductor supply chains and partners. 

Leadership and Communication 

• Highly organised with strong prioritisation discipline 

• Structured thinker with rigorous risk management instincts 

• Clear, concise communicator able to operate confidently with both engineers and executives 

What We Offer

• Competitive salary: A competitive salary reflective of your experience and the specialist nature of the role.
• Equity & Ownership: meaningful equity so everyone shares in the value creation
• Benefits: Private Medical, Dental and Vision, Contributory Pension, 25 Days holiday plus bank holidays and Life/Critical Illness Insurance.
• Diverse & fun office: we believe the hardest problems get solved by the broadest range of minds. We are committed to Equal Employment Opportunity through attracting and retaining a diverse team and building an inclusive environment. 

Fractile is seeking to increase the clock speed of global progress, one chip at a time. We’ve recently raised $220M from investors including Founders Fund and Accel and our most important work lies ahead. Join us!

Export controls

Our work involves technologies subject to UK, US and other international export control regulations. Certain roles may require additional eligibility checks to ensure compliance with applicable law. We'll be transparent about this throughout the hiring process.