The Lead Application Engineer is a strategic role supporting board level encapsulant application development and customers field service needs.
This position acts as the interface between field and lab in capturing and translating customers’ needs for new applications and products.
Some specifics include design and administration of internal screening evaluations of developmental and commercialized products, optimization of material assembly processes and direct interaction with customers to troubleshoot and solve product and process related problems.
Knowledge of circuit board encapsulant products and surface mount technology are required.
Demonstrated direct customer engagement skills are also required.
This role requires close collaboration with cross-functional teams globally.
This role also needs to provide global on-site support for our customers as needed.
Knowledge of liquid application equipment and process are highly valued.
In addition, the individual needs to travel up to 25% globally, covering all our consumer electronics manufacturing customers.
This multifaceted role requires approximately 50% of the time working with Lab-Application Engineering personnel to bridge customer needs and 50% of the time working directly with the customers on technical support.
Required Background & Experience
Bachelor/Master’s degree with 7+ years of working experience or a doctor’s degree with 5+ years of working experience in R&D or application engineering field
Education in engineering or material science discipline is required
Direct customer support experience is required
Experience in material handling such as dispensing and printing is a plus
Knowledge of statistical analysis using MiniTab and/or JMP is desirable
Demonstrated ability in working with a cross functional Sales/Product Development/Marketing team is highly desirable
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