- Location
- HLT-Hong Leong Tower, Malaysia
- Type
- Full-time
- Department
- Engineering
- Seniority
- Manager
- Closing date
- Today
- Source
- Workday
Description
If you are looking to excel and make a difference, take a closer look at us…
Overview:
The Manager, Electrical & Electronics (E&E) / Semiconductor Specialist within the Business & Corporate Banking (BCB) Division will evaluate technology projects, assess equipment and operational risks, and advise banking teams on sector-specific financing decisions. We welcome semiconductor industry professionals—such as engineers, plant leads, and technical strategists—to apply their domain expertise to corporate banking. Prior banking experience is not required.
Key Responsibilities
- Conduct Technical Due Diligence: Travel to semiconductor fabs, OSAT plants, data centers, and equipment assembly sites to inspect machinery and infrastructure, verify setup progress, and validate project feasibility.
- Support Deal Structuring: Translate equipment capital expenditure, setup schedules, power/cooling infrastructure requirements, and yield targets into practical credit and financing solutions
- Assess Sector Risks: Evaluate operational reliability, tool depreciation, technology obsolescence, and supply chain stability for technology vendors and equipment suppliers.
- Advise Banking Teams: Serve as an internal technical expert connecting tech clients, Relationship Managers, and credit committees to ensure accurate risk assessments.
- Track Trade Dynamics: Provide insights on global trade policies, export restrictions, tariffs, and supply chain disruptions affecting the sector.
- Identify Business Leads: Utilize industry networks and sector insights to spot prospective corporate clients and refer business opportunities to Relationship Managers
What We Are Looking For:
- Bachelor’s degree in Electrical & Electronics Engineering, Computer Engineering, or a related technical field.
- 8 years and above of experience in the semiconductor ecosystem (e.g., fabs, OSAT plants, automated test equipment OEMs) or the data center ecosystem (e.g., AI/HPC hardware clusters, server infrastructure, precision power and cooling systems).
- Clear understanding of front-end/back-end manufacturing processes or data center physical/power infrastructure, machine lead times, precision tooling, and emerging trends (such as AI hardware acceleration, 2.5D/3D ICs, and chiplets).
- Demonstrated capability to evaluate high-value hardware installations, tool depreciation cycles, facility commissioning, and operational supply chain risks.
- Practical understanding of global supply chain dynamics, trade regulations, export controls, and policy impacts on technology hardware.
- Ability to distill complex technical details into clear, concise risk and business insights for internal stakeholders (including banking and risk teams) and external clients.
About Hong Leong Bank
We are a leading financial institution in Malaysia backed by a century of entrepreneurial heritage. Providing comprehensive financial services guided by a Digital-at-the-Core ethos has earned us industry recognition and accolades for our innovative approach in making banking simpler and more effortless for our customers. Our digital and physical offerings span across a vast nationwide network in Malaysia, strengthened with an expanding regional presence in Singapore, Hong Kong, Vietnam, Cambodia, and China.
We seek to strike a balance between diversity, inclusion and merit to achieve our mission of infusing diversity in thinking and skillsets into our organisation. Candidates are assessed based on merit and potential, in line with our mission to attract and recruit the best talent available. Expanding on our “Digital at the Core” ethos, we are progressively digitising the employee journey and experience to provide a strong foundation for our people to drive life-long learning, achieve their career aspirations and grow talent from within our organisation.
Realise your full potential at Hong Leong Bank by applying now.