- Location
- SG
- Type
- Full-time
- Department
- Engineering
- Seniority
- Senior
- Source
- Eightfold
Description
Req. ID:
JR115059 STAFF ENGINEER, PKG SI INT
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Staff Engineer, Package-Silicon Integration
As a Staff Engineer, Package-Silicon Integration in Micron’s Package Development Engineering (PDE) organization, you will drive package-silicon integration for next-generation NAND packaging technologies.
You will collaborate across silicon design, wafer fabrication, package design, assembly, reliability, and manufacturing to identify and mitigate chip-package interaction risks. You will independently lead complex technical workstreams, develop integration solutions, and leverage AI-enabled and data-driven methods to accelerate engineering learning and enable robust design and manufacturing solutions.
Key Responsibilities
- Lead Chip-Package Interaction (CPI) risk assessments for new silicon, package architectures, materials, and processes.
- Partner with silicon, package, wafer fab, and assembly teams to resolve dicing, singulation, die integrity, and integration challenges.
- Lead technical investigations using DOE, statistical analysis, physical characterization, failure analysis, reliability data, and AI-enabled analytical approaches where appropriate.
- Drive root-cause analysis and solutions for yield, quality, reliability, and manufacturability issues.
- Define and execute test vehicles, characterization strategies, process windows, and qualification plans.
- Translate technical learning into design rules, specifications, FMEA controls, and Best-Known Methods (BKMs).
- Leverage AI, automation, and data analytics to improve engineering efficiency, technical insight, knowledge capture, and decision-making.
- Drive technology readiness and transition of new silicon and package technologies into manufacturing.
- Identify integration and capability gaps and develop scalable technical solutions.
- Communicate technical risks, findings, and recommendations across engineering teams and leadership.
- Provide technical guidance and mentoring while promoting effective AI-enabled ways of working.
Minimum Qualifications
Education & Experience
- Bachelor’s degree or higher in Mechanical, Materials, Electrical/Electronic, Chemical, Semiconductor Engineering, Physics, or a related technical discipline.
- Min 4 to 5 years of relevant semiconductor experience in either package-silicon integration, advanced packaging, wafer technology, assembly, reliability, materials, or process development.
- Demonstrated ability to independently lead complex technical investigations.
Technical & Professional Skills
- Strong understanding of semiconductor fabrication, packaging, assembly, materials, and/or reliability.
- Experience in areas such as CPI, wafer/die mechanics, dicing, die integrity, package assembly, characterization, failure analysis, or reliability.
- Experience with DOE, statistical analysis, root-cause analysis, DFMEA/PFMEA, and structured problem solving.
- Ability to connect physical failure mechanisms to silicon, package, material, and process interactions.
- Ability to translate technical findings into design requirements, process specifications, and manufacturing controls.
- Proficiency in using data analytics, automation, and AI-enabled tools to improve engineering analysis, productivity, technical documentation, and problem solving.
- Ability to critically assess AI-generated outputs and apply engineering judgment and data validation before using them for technical decisions.
- Strong cross-functional collaboration, technical leadership, and communication skills.
Job Profile(s):
Product Development Engineer 4 - Product Development Engineer 5
Relocation level: (TBD)
Before Getting Started
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- Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.
- If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.