Product Integration Engineer

Req. ID:

JR116999 Product Integration Engineer

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Key Responsibilities

1\. Advanced Package Development (Technology & Process Integration)

• Lead process integration for new package architectures, including materials, structure, and process flow definition
• Drive development builds (FUT/ES), data analysis, and learning cycles to mature process capability
• Perform technical risk assessment (TRA), DOE planning, and failure mechanism analysis to identify and mitigate risks
• Define and optimize Critical-to-Quality (CTQ) parameters, process window, and yield performance
• Collaborate with Technology Development (TD) and design teams on design-for-manufacturability (DFM) and process feasibility

Development activities align with the requirement to validate package functionality and ensure readiness before qualification and manufacturing handoff

2\. NPI Execution & Qualification Readiness

• Own process integration deliverables across NPI phase gates
• Drive qualification builds (QS) and ensure readiness for Qualification Release (QR)
• Develop and execute qualification plans, reliability validation, and defect reduction strategies
• Lead FMEA (DFMEA/pFMEA) development, defect program management, and risk closure
• Ensure all phase gate deliverables and qualification criteria are met for product release

The role directly supports structured NPI execution including phase gate reviews, qualification, and product launch readiness

3\. Yield, Quality, and Manufacturing Readiness (HVM Enablement)

• Drive yield ramp, defect reduction, and process stability toward high-volume manufacturing
• Partner with Manufacturing (Ops), Quality, and Site teams to ensure process transfer and production readiness
• Lead issue resolution and root cause analysis for yield and reliability excursions
• Support safe launch readiness and quality compliance requirements

4\. Cross-Functional Program Leadership

• Act as the PI owner interfacing across TD, PIE, NPI, QA, CEM, and Operations teams
• Drive alignment on program milestones, risks, and mitigation plans
• Provide technical leadership during phase gate reviews and executive updates
• Ensure effective communication across multi-site execution (e.g., development site → OSAT / manufacturing site)

5\. Continuous Improvement & Process Maturity

• Improve process maturity (PMI progression) and enable scalable manufacturing capability
• Lead continuous improvement (CIP) activities for yield, cycle time, and cost optimization
• Capture learnings and feed back into design rules, process standards, and NPI methodology

Required Qualifications

• Bachelor’s or Master’s degree in Engineering (Materials, Chemical, Electrical, Mechanical, or related field)
• 5–10+ years experience in semiconductor advanced packaging / process integration
• Strong knowledge of:
• Advanced packaging (TSV based)
• Process integration, yield analysis, and defect mechanisms
• Qualification, reliability, and NPI phase gate execution
• Experience in cross-functional program execution and multi-site collaboration

AI Relevant Job Responsibilities:

\- Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

\- Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

\- Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business

Job Profile(s):

Product Development Engineer 3

Relocation level: (TBD)

Before Getting Started

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• Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.
• If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.

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As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.