- Location
- TWN-New Taipei City Office, Taiwan
- Type
- Full-time
- Department
- Engineering
- Source
- Workday
Description
Preferred Qualifications
- Experience with direct-to-chip cooling, cold plates, rack-level cooling, CDU integration, immersion cooling, or chip-to-chiller architectures.
- Experience with AI servers, HPC platforms, GPU/accelerator systems, power electronics, or high-density data center infrastructure.
- Knowledge of manufacturing technologies, coolant compatibility, corrosion, filtration, contamination control, leak detection, sealing strategy, and long-term reliability risks.
- Supplier-facing experience with design reviews, tooling, process qualification, cost reduction, and production ramp.
- Familiarity with thermal cycling, vibration, shock, pressure cycling, HALT/HASS, and environmental stress testing.