- Salary
- $150k – $170k
- Location
- Irvine, CA, US
- Type
- Full-time
- Department
- Engineering
- Source
- Breezy HR
Description
Thermal/Mechanical Engineer
Reports To: Vice President, Systems Engineering
Company Overview:
Netlist Inc. (NASDAQ: NLST) is a leading provider of high-performance modular memory subsystems and next-generation storage-class memory solutions. We specialize in cutting-edge technologies that enable innovation in AI, cloud computing, and enterprise infrastructure. Our product portfolio includes DDR4/DDR5 DIMMs, NAND-based SSDs, and advanced interconnect technologies such as CXL and PCIe.
Join our world-class engineering team and be part of shaping the future of memory and storage architecture.
Position Summary
Netlist is looking for an exceptional Thermal/Mechanical Engineer to develop thermal solutions for memory and storage products for sale to top tier OEMs/ODMs and Hyperscalar customers.
Key Responsibilities:
- Create mechanical and thermal models of electrical and mechanical assembles either from scratch or from PCB CAD files
- Source or design thermal solutions for memory and storage products.
- Run thermal simulations to verify the thermal solutions meet the specified requirements
- For custom designs, specify all the required materials and create fabrication and assembly drawings as necessary
- Create and implement Design of Experiments (DoEs) to evaluate thermal properties of electrical assemblies
- Feedback concerns and suggestions to electrical team
- Create assembly drawings which specify the assembly process
- Work with manufacturing to ensure that assemblies are created properly
Required Qualifications:
- BSEE or MSEE (preferred) in Mechanical Engineering, Thermal Engineering, or related field of study with 8+ years of directly related industry experience in IC Packaging Design.
- Must have knowledge of mechanical drawing tools (AutoCAD, SolidWorks, etc.)
- Must have knowledge of thermal analysis/simulation tools (Flowtherm, Icepak, etc.))
- Knowledge of thermal materials (IC heat sinks and heat spreaders, thermal greases and epoxies, thermal gap pads, etc.) is desirable.
- Must possess the drive to innovate and tackle new challenges.
- Must possess good communication skills and professionalism in representing his/her work.
- Must have excellent problem-solving skills
- Must have strong interpersonal skills, stakeholder management, communication and influencing skills
- Must have the ability to assume responsibility and be proactive in taking initiative to address issues, set direction and meet commitments
- Knowledge of memory/storage components (DDRx, LPDDRx, NAND) and modules (DIMMs, SSDs, etc.) is very desirable.
- Physical demands for an office position with heavy computer use
- Ability to travel (less than 10%)
Salary Range: $150,000 - 170,000
