Hiring.Camp

Principal Product Engineer - Memory IP

Cadence Design

·

Today

Location
Nanjing, China · SHANGHAI
Type
Full-time
Department
Engineering
Seniority
Lead
Education
Master
Source
Workday

Description

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

 Primary Responsibilities:
○ Supporting pre-silicon integration, usage, and implementation of memory subsystem products
○ Helping with internal system integration and QA testing of memory subsystem products (Controller + PHY)
Analyzing and resolving complex subsystem application or implementation issues and providing
professional guidance to customers
○ Supporting various memory PHY and controller SOC integration reviews and implementation reviews
○ Assisting customers with RTL and gate-level simulations to verify functionality
○ Assisting customers with timing closure and other aspects of physical integration
Participating in development and refinement of product documentation and checklists for customer
applications
○ Supporting post-silicon bringup and production test activities for customers as needed
Enhancing customer experience by providing prompt, thorough, and technically accurate responses to
customer questions
○ Leveraging AI-powered tools and assistants to enhance productivity, improve decision making, and maintain
high-quality customer deliverables.
○Applying AI-powered analytics tools to extract insights, identify patterns, and generate actionable
recommendations from complex datasets

Position Requirements:
○ B.S Electrical/Computer Engineering (or similar degree) and 7+ years of overall experience -OR- M.S
Electrical/Computer Engineering (or similar degree) and 5+ years of overall experience
○ Experience working with DDR5/4/3, LPDDR5/4/3, HBM3, GDDR6 or similar IPs
○ Verilog RTL design and gate level verification experience
○ Synthesis and static timing analysis experience (physical implementation/verification experience is a plus)
○ Familiarity with industry standard DFT flows and test methodologies.
○ Familiarity with package and board design
○ Ability to read schematics and participate in SI/PI reviews for customer board/package implementation

Preferred Qualifications
○ Experience with Memory PHY and DSP based architecture
○ Experience with embedded microcontroller FW
○ Background with scripting and applying AI solutions to daily workflows

 

We’re doing work that matters. Help us solve what others can’t.

Skills

SOC

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