MTS – ASIC Silicon Debug, Device Technology & Yield Engineering
Micron Technology
·2 days ago
- Location
- Hsinchu County,TW, TW · Taichung City,TW, TW
- Type
- Full-time
- Department
- Engineering
- Source
- Eightfold
Description
Req. ID:
JR106948 MTS – ASIC Silicon Debug, Device Technology & Yield Engineering
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Key Responsibilities
Post-Silicon Yield & RMA Leadership
- Lead end-to-end investigation of silicon yield loss, field returns, customer escalations, and reliability failures.
- Drive root-cause analysis for complex silicon issues spanning process, design, test, package, and system interactions.
- Develop hypothesis-driven debug strategies and coordinate cross-functional execution.
- Own resolution of critical yield and quality issues through containment, corrective actions, and prevention plans.
Device Technology & Process Interaction Analysis
- Analyze device-level failure mechanisms and process sensitivities impacting ASIC functionality and yield.
- Evaluate design-process interactions affecting analog, mixed-signal, memory, high-speed I/O, and PCIe PHY performance.
- Partner with foundry teams to understand process variations, excursions, reliability risks, and technology limitations.
- Translate silicon learning into actionable design and process improvements.
Advanced ASIC Design Interaction & Silicon Debug
- Lead root-cause investigations involving design-process interactions affecting SRAM, PCIe PHY, ONFI interfaces, SerDes, analog/mixed-signal circuits, and high-speed digital subsystems.
- Analyze silicon failures across transistor, circuit, block, die, package, and system levels.
- Drive post-silicon debug activities involving design teams, DFT, product engineering, quality, reliability, foundry, and customer support organizations.
- Debug complex failure mechanisms including:
- SRAM single-bit and multi-bit failures
- Read/write margin failures
- Timing and voltage sensitivity issues
- PCIe PHY performance degradation
- Signal integrity and jitter-related failures
- Yield excursions linked to process variation
- Field-return and RMA failures
- Develop silicon characterization plans to isolate process, design, and test-related contributors.
- Drive silicon learning feedback into next-generation ASIC architecture and design methodologies.
Failure Analysis & Physical Debug
- Drive advanced FA activities including:
- FIB
- SEM/TEM
- EFA
- OBIRCH
- LVP
- Emission microscopy
- Physical cross-section analysis
- Correlate failure signatures with design, process, and manufacturing data.
- Interpret FA results and convert findings into clear engineering actions.
Cross-Functional Technical Leadership
- Lead technical reviews with Product Engineering, DFT, Design, Reliability, Quality, Operations, Foundry, and external partners.
- Present complex technical findings to executive leadership.
Influence design and technology roadmaps to improve future product robustness and yield learning.
Experience
- 12+ years of semiconductor industry experience.
- Strong background in advanced CMOS technology and silicon product development.
- Proven success leading yield improvement, RMA, and failure analysis efforts.
- Experience working directly with foundries and OSAT partners.
Technical Expertise
- Deep understanding of CMOS device physics and advanced semiconductor process technologies.
- Strong expertise in SRAM architecture, memory design fundamentals, memory margin analysis, and failure mechanisms.
- Strong understanding of high-speed interface technologies including PCIe, ONFI, SerDes, and clocking architectures.
- Experience with post-silicon debug and characterization of complex ASIC devices.
- Expertise in process-design interaction analysis and variation-aware design methodologies.
- Strong knowledge of:
- Signal Integrity (SI)
- Power Integrity (PI)
- Timing closure methodologies
- Device variability and mismatch analysis
- Reliability-induced failure mechanisms
- Experience correlating:
- Wafer Acceptance Test (WAT)
- Electrical test data
- Yield data
- Reliability data
- Failure Analysis results
- Customer-return information
Preferred Qualifications
- Experience supporting SSD controller, AI accelerator, networking, or high-performance compute ASICs.
- Expertise in PCIe PHY, SerDes, memory subsystem, or analog mixed-signal debug.
- Track record resolving field-quality issues visible to executive leadership and customers.
- Experience utilizing AI/ML tools for yield analytics, anomaly detection, and RCA acceleration.
- Experience mentoring engineering teams and driving multi-site technical investigations.
- AI Proficiency: Demonstrated ability to leverage AI-enabled tools, data analytics, and automation technologies to improve engineering productivity, accelerate root-cause analysis, and enhance decision-making in complex semiconductor development and manufacturing environments.
Success Metrics
- Reduction in RMA investigation cycle time.
- Faster closure of silicon root-cause investigations.
- Yield improvement driven through systematic learning.
- Improved containment and corrective action effectiveness.
- Reduced repeat excursions through preventive actions.
- Increased cross-functional execution efficiency.
- Enhanced customer confidence through timely and technically sound issue resolution.
Job Profile(s):
ASIC Engineer 5 - ASIC MTS
Relocation level: (TBD)
Before Getting Started
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