- Location
- New Jersey, Hoboken
- Type
- Full-time
- Department
- Education
- Education
- PhD
- Source
- Freshteam
Description
Location: Hoboken, NJ
Department: Tomorrow
Reports to: Ting Bu
Position Overview
The Research Scientist will work on the modeling, simulation, and architectural development of
quantum and artificial intelligence (AI) computational structures intended for chip-scale
implementation. This role focuses on translating advanced quantum and AI concepts into
physically realistic, simulation-validated device and system designs suitable for fabrication. It
concentrates on high-fidelity simulation, feasibility analysis, and performance optimization under
practical fabrication constraints. The role serves as a technical bridge between the research
team developing novel quantum/AI architectures and the chip fabrication team responsible for
implementation, ensuring that proposed designs are physically realizable, scalable, and
performance-optimized prior to tape-out.
Duties and Responsibilities
● Develop and simulate quantum and AI-based photonic architectures for on-chip
implementation.
● Translate high-level computational concepts into device-level and system-level
simulation models.
● Perform rigorous electromagnetic and multiphysics simulations to evaluate optical,
nonlinear, and quantum effects.
● Model and simulate quantum photonic circuits and quantum gates under realistic device
conditions.
● Analyze fabrication tolerances and material constraints to assess design robustness.
Optimize photonic device structures for performance, scalability, and manufacturability.
● Collaborate closely with fabrication and packaging teams to ensure simulation models
align with process capabilities.
● Support post-fabrication validation by correlating experimental results with simulation
predictions.
● Document modeling methodologies, simulation results, and architectural trade-offs for
internal and external reporting.
Required Qualifications
Education
● Ph.D. in Physics, Applied Physics, Electrical Engineering, or a closely related discipline.
Technical Background
● Strong foundation in Photonics, Quantum optics, Nonlinear optics
● Demonstrated experience in simulation of photonic integrated circuits.
● Experience modeling and simulating quantum gates or quantum optical systems.
● Understanding of semiconductor/TFLN and photonic chip fabrication processes sufficient
to incorporate realistic constraints into simulations.
● Familiarity with chip testing and packaging considerations from a modeling perspective.
Software Proficiency
● Lumerical (FDTD, MODE, INTERCONNECT)
● Tidy3D
● COMSOL Multiphysics
● Python
● MATLAB
Department: Tomorrow
Reports to: Ting Bu
Position Overview
The Research Scientist will work on the modeling, simulation, and architectural development of
quantum and artificial intelligence (AI) computational structures intended for chip-scale
implementation. This role focuses on translating advanced quantum and AI concepts into
physically realistic, simulation-validated device and system designs suitable for fabrication. It
concentrates on high-fidelity simulation, feasibility analysis, and performance optimization under
practical fabrication constraints. The role serves as a technical bridge between the research
team developing novel quantum/AI architectures and the chip fabrication team responsible for
implementation, ensuring that proposed designs are physically realizable, scalable, and
performance-optimized prior to tape-out.
Duties and Responsibilities
● Develop and simulate quantum and AI-based photonic architectures for on-chip
implementation.
● Translate high-level computational concepts into device-level and system-level
simulation models.
● Perform rigorous electromagnetic and multiphysics simulations to evaluate optical,
nonlinear, and quantum effects.
● Model and simulate quantum photonic circuits and quantum gates under realistic device
conditions.
● Analyze fabrication tolerances and material constraints to assess design robustness.
Optimize photonic device structures for performance, scalability, and manufacturability.
● Collaborate closely with fabrication and packaging teams to ensure simulation models
align with process capabilities.
● Support post-fabrication validation by correlating experimental results with simulation
predictions.
● Document modeling methodologies, simulation results, and architectural trade-offs for
internal and external reporting.
Required Qualifications
Education
● Ph.D. in Physics, Applied Physics, Electrical Engineering, or a closely related discipline.
Technical Background
● Strong foundation in Photonics, Quantum optics, Nonlinear optics
● Demonstrated experience in simulation of photonic integrated circuits.
● Experience modeling and simulating quantum gates or quantum optical systems.
● Understanding of semiconductor/TFLN and photonic chip fabrication processes sufficient
to incorporate realistic constraints into simulations.
● Familiarity with chip testing and packaging considerations from a modeling perspective.
Software Proficiency
● Lumerical (FDTD, MODE, INTERCONNECT)
● Tidy3D
● COMSOL Multiphysics
● Python
● MATLAB
Skills
PythonMATLAB