- Location
- Hong Kong · Kuala Lumpur
- Type
- Full-time
- Department
- Engineering
- Seniority
- Senior
- Education
- Master
- Source
- Workday
Description
About the role:
If you are passionate about pushing technical boundaries while leading teams to deliver real impact in the field, this is your opportunity to make it happen.
We are looking for a driven Die Bond Product Engineering Manager to lead the next generation of die attach technology, shaping how our equipment performs in real customer applications. In this role, you will own the intersection of machine innovation, process expertise, and customer success, turning complex semiconductor requirements into cutting‑edge, high‑performance solutions.
What You will Be Doing:
- Own the process application and performance of the die bonder product portfolio across key packaging segments
- Define product requirements, use‑case scenarios, and application benchmarks for new platforms or modules
- Lead die attach development, qualification, and NPI ramp to high‑volume manufacturing
- Drive yield, reliability, and downtime reduction through structured data analysis and root cause analysis
- Set technical direction for die bond equipment strategy, automation, and future technologies
- Act as senior escalation point and technical authority for complex product and customer issues
- Lead, mentor, and develop a team of product and application engineers with strong competence in die attach applications, tool capability, and problem‑solving
- Partner with R&D, Manufacturing, Quality, and Supply Chain to deliver robust, scalable solutions
- Ensure die bonder products remain competitive in performance, flexibility, reliability, and total cost of ownership
What You Will Need:
- Bachelor or Master degree in Engineering or related discipline
- 10yrs+ experience in Semiconductor backend or high precision equipment manufacturing
- Advanced disciplinary knowledge and expertise in product management
- Proven leadership in product engineering, NPI, and mass production environments
- Able to balance technical depth with strategic decision‑making and people leadership
- Team builder and player, with strong cultural awareness
- Sound skill in leading cooperative efforts across different teams to deliver results
- Good communication skills
- Able to speak Mandarin and/or Cantonese will be a plus
Talent acquisition based on ITEC vacancies is not appreciated. ITEC job adverts are ITEC copyright © material and the word ITEC® is a registered trademark.
ITEC is an Equal Opportunity/Affirmative Action Employer.