- Location
- US NC Silicon Drive, United States of America
- Type
- Full-time
- Department
- IT
- Seniority
- Manager
- Education
- Master
- Source
- Workday
Description
As Product Marketing Manager for Advanced Packaging, you will own the go-to-market strategy and product positioning for Wolfspeed's SiC substrate portfolio in 2.5D and 3D packaging for high-performance computing (HPC) and AI data center applications. Building on Wolfspeed's 35+ years of SiC materials leadership and an established set of proven use cases, you will define how we articulate SiC's value — across heat spreaders and carriers, passive and active interposers — to hyperscalers, foundries, OSATs, and EDA ecosystem partners. You will translate deep market and customer requirements into a compelling roadmap and messaging, and work closely with the same partners and customers to shape demand for next-generation architectures. The ideal candidate combines a strong technical grasp of advanced packaging with proven product-marketing, market-analysis, and storytelling skills.
The ideal candidate will be located in the US.
Key Responsibilities
- Own product positioning, messaging, and value propositions for the SiC advanced-packaging portfolio, tailored to hyperscalers, foundries, OSATs, and EDA partners.
- Define and maintain the go-to-market strategy and launch plans for new SiC packaging products, interposer specifications, and PDK enhancements, in partnership with product management and applications engineering.
- Conduct market sizing, competitive analysis, and use-case prioritization — benchmarking SiC against competitive materials — and proactively identify and champion new SiC applications.
- Engage closely with partners, customers, and foundries to validate requirements, shape demand, and co-develop the narrative for next-generation packaging architectures.
- Build sales-enablement assets, reference materials, and competitive collateral; support training for Wolfspeed sales teams, foundry partners, and EDA ecosystem players on SiC value and design guidelines.
- Develop and deliver thought-leadership content at packaging industry conferences and tradeshows and ecosystem partner workshops.
- Feed consolidated customer and market requirements back to product management and R&D to guide the SiC packaging roadmap.
Qualifications
- Bachelor's Degree in Electrical Engineering, Materials Science, Marketing, or equivalent; technical degree with marketing experience (or MBA) preferred.
- Deep industry know-how on the requirement side — an insider's understanding of how hyperscalers, foundries, and OSATs specify advanced packages
- Strong understanding of wide band-gap materials
- Ability to communicate SiC's technical value proposition (thermal conductivity, mechanical robustness, RF performance) to both engineering and executive audiences at foundries, OSATs, and chip designers.
- Exceptional negotiation, communication, and executive relationship-building skills.
- Willingness to travel globally.
- Passion for building breakthrough growth in an emerging, technically complex market.
We are an equal opportunity employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, national origin, disability status, protected veteran status, or any other characteristic protected by law.
