New Product Introduction Process/Tooling Engineer

New Product Introduction Process/Tooling Engineer

Description -

Are you passionate about technology and eager to work in a startup environment that leverages the brand recognition, solution capabilities, and global reach of a world-class technology pioneer like HP?

This Process and Tooling Engineering position is within HP’s liquid cooling solutions business in the Microfluidic Technology Organization (MTO). This role supports both R&D prototyping and production processes.  This person will work as a key New Product Introduction (NPI) engineer as part of a diverse, worldwide team of R&D and manufacturing engineers and managers with a focus on developing manufacturable processes for new products.  As an NPI engineer, you will work closely with both R&D and manufacturing teams to develop products and fabrication processes that meet customer needs.

This person applies subject matter knowledge to solve common and complex business issues within established guidelines and recommends appropriate alternatives. Works on problems of diverse complexity and scope. Will act as a team or project leader providing direction to team activities including collaborating with the team on driving positive change.  They will exercise judgment within generally defined policies and practices to identify and select solutions to technical problems.  

NPI Process and Tooling Engineering – What you will do

• Understand customer (product) and manufacturing (process) requirements

• Design engineering solutions for mechanical, electrical and electronic parts, subsystems, integrated circuitry, and algorithms based on engineering fundamentals

• Develop and implement new tooling designs, process parameters and test plans for new and existing products, including validation of tolerances, form/fit/function, shock and vibration, electromagnetic interference, safety, reliability, thermal generation, and system power measurements

• Lead key initiatives to solve issues or reduce risks caused by new technologies or processes

• Collaborate and communicate with management, internal, and outsourced development partners regarding design status, project progress, and issue resolution

• Lead project teams of other engineers and internal and outsourced development partners to develop reliable, cost effective and high quality solutions for our products

• Lead teams that drive root cause evaluation and issue resolution as problems arise in proto and production.

• Assist with Design for Manufacturability (DFM) and Development Effectiveness in new product development to reduce risk at launch of new products

• Provide guidance and mentoring to less- experienced staff members

Qualifications

• Education: Bachelor's or Master's degree in Mechanical, Electrical, Chemical or Materials Engineering

• 10+ years’ experience in a product or process development or production environment

• Desired: experience in complex printed circuit board and/ or GPU board manufacturing

Desirable skills as follows

• Using design tools and software packages

• Strong analytical and problem solving skills

• Designing mechanical tooling and associated algorithms

• Using empirical analysis, modelling and testing methodologies to validate component, circuit, and hardware designs and thermal/emissions management

• Knowledge of different issue resolution methods (e.g., 8D, CLCA, etc.) and how to effectively implement

• Ability to broadly contribute in a fast-paced, industrial R&D environment

• Excellent communication and teamwork skills

• Excellent planning, organizational, and documentation skills

• Ability to give clear and effective presentations to inform and persuade peers and managers

The pay range for this role is $116,150 to $182,400 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.

Benefits:

HP offers a comprehensive benefits package for this position, including:

• Health insurance

• Dental insurance

• Vision insurance

• Long term/short term disability insurance

• Employee assistance program

• Flexible spending account

• Life insurance

• Generous time off policies, including;

• 4-12 weeks fully paid parental leave based on tenure

• 11 paid holidays

• Additional flexible paid vacation and sick leave (US benefits overview)

The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.

Job -

Engineering

Schedule -

Full time

Shift -

No shift premium (United States of America)

Travel -

Not Specified

Relocation -

Yes

Equal Opportunity Employer (EEO) - 

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “Know Your Rights: Workplace Discrimination is Illegal"