Semiconductor Principal Design Engineer

Req. ID:

JR106037 Semiconductor Principal Design Engineer

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Position Overview

The Principal Design Engineer in Micron’s NVEG organization contributes to the development of new memory products by assisting with the overall design, layout, and optimization of datapath circuits for NAND flash memory. This position will drive task forces and make strategic decisions on major datapath architectural changes influenced by new design specs such as higher speed/lower power. They will assess pros and cons of new architecture and drive all activities pertaining its implementation. The role will be expected to lead technical datapath design projects, directing the design planning, layout, and validation activities according to project timelines.

Responsibilities

• Design and optimize TSV(Through-Silicon Via) interface circuits connecting memory die to logic die including Rx/Tx circuit for internal TSV channels, impedance matching and timing margin analysis.
• Develop and characterize TSV electrical models and define circuit design constraints for datapath interface.
• Define and implement signal integrity requirements for the TSV channel, including eye margin, crosstalk, and noise budget analysis
• Define and implement power integrity requirements using TSV for highly parallel IO and array operations
• Design and verify TSV-specific DFT (Design for Testability) circuits including loopback test modes, TSV continuity checks, and lane redundancy/remapping logic
• Interface with process technology and DTCO teams to optimize TSV design rules, standard cell usage, and layout strategies for the internal datapath
• Develop and execute functional verification plan for TSV interface and internal parallel bus including full chip circuit simulation and Verilog regression
• Design and optimize the wide internal parallel data bus spanning multiple arrays, channels and pseudo-channels, ensuring timing closure and signal integrity across the full parallel bus
• Architect the data path from the page buffer through data line sense amplifier, redundancy logic, and bus driver to the TSV output interface, managing parallelism across bank groups and banks.
• Develop clocking and synchronization strategies for the highly parallel internal bus including wave pipeline design, clock distribution, and skew management
• Implement and optimize column redundancy and lane repair schemes compatible with HBM like highly parallel bus architecture
• Define timing budgets and perform timing analysis across the full internal datapath under PVT variations
• Support post-silicon validation, debug and correlation activities; identify schematic edits and drive necessary tape-out revisions.
• Collaborate with packaging and assembly teams to ensure TSV reliability constraints are met within the datapath floorplan
• Communicate with project integration and other functional teams in design on specifications of major block interfaces
• Communicate with PE to drive silicon experiments and propose fixes and improvements for yield improvement and silicon debugging.
• Communicate with Apps regarding introduction of new specs and limitations based on design requirements and limitations.
• Document and review final results with experts and stakeholders

Minimum Qualifications

• BS or MS in Electrical Engineering with 8+ years of relevant experience in memory circuit design, preferably in DRAM, NAND or other high-density memory technologies.
• Experience with TSV(Through-Silicon Via) interface circuit design or high-speed memory interface design(NV-LPDDR4, DDR4/5, LPDDR5/6, HBM3/3E/4), including timing analysis, parasitic modeling, and signal integrity.
• Advanced knowledge and understanding of highly parallel bus performance, power and area optimization including clock distribution and skew management across wide data paths, and EpB(Energy per Bit) optimization in the context of 3D-stacked memory architectures.
• Experience managing complex circuit design projects spanning multiple functional blocks and cross-functional teams, with the ability to effectively communicate design trade-offs, schedule progress, and technical outcomes to both design and non-design stakeholders
• Applying AI to daily work and design work flow to improve quality and efficiency.

Preferred Qualifications

• Hands on experience in utilizing AI to improve quality of design and efficiency
• Experience on chip level PDN optimization
• Comprehensive understanding on CMOS device and device reliability
• Comprehensive understanding on CMOS BSIM model and CMOS target for high speed IO operation
• Experience with signal/power integrity, power delivery network design, physical design

Job Profile(s):

Semiconductor Design Engineer 5

Relocation level: (TBD)

Before Getting Started

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As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.