Senior Program Manager

Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: 3D metrology spanning the chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient.

Job Summary & Responsibilities

The Technical Product Manager works with the Director of Product Management to turn product priorities into clear cross functional plans, owners, timelines, and follow through. This person needs to be technically credible, organized enough to spot missing work early, and comfortable pushing cross functional teams to close gaps before they become program problems. With visibility across the product lifecycle, this person drives follow up across functions, surfaces risks early, closes ownership gaps, and keeps critical commitments moving.

This role helps keep the full program coordinated across technical, operational, and business functions, including risk, cost, schedule, readiness, and open commitments. The Technical Product Manager proactively identifies issues before they threaten product objectives and works across functional organizations to drive resolution. The right candidate will bring technical breadth and credibility, high organization, attention to detail, and the ability to influence teams that do not report directly to them. Successful candidates often come from Systems Engineering, Technical Program Management, New Product Introduction (NPI), Product Management, Product Lifecycle Management, or Engineering Leadership roles within semiconductor capital equipment organizations.

Core Responsibilities

• Keep risk, cost, schedule, readiness, and open commitments visible.

• Identify risks early and coordinate mitigation with clear owners.

• Review accountability, clarify priorities, and advance critical deliverables.

• Keep cross-functional commitments, dependencies, and resources aligned.

• Track schedules and help drive recovery when commitments slip.

• Monitor COGS, cost drivers, and meaningful cost changes.

• Ensure required documentation, test plans, training, and release deliverables are completed.

• Where policy does not exist, help define and roll out new policies to cover the need.

• Help new processes become normal operating behavior.

• Coordinate readiness for milestones, releases, transitions, deployments, and qualifications.

• Separate task completion from true operational readiness.

• Build technical breadth, challenge assumptions, and communicate risks and tradeoffs.

Qualifications

• BS, MS, or PhD in Physics, Electrical Engineering, Mechanical Engineering, Optical Engineering, Materials Science, Systems Engineering, Semiconductor Engineering, or another relevant technical discipline.

• 10+ years in semiconductor capital equipment, manufacturing, metrology, inspection, process control, systems engineering, NPI, product lifecycle management, or related technical industries.

• Experience leading large cross-functional technical initiatives.

• Experience managing product or program risk, cost, and schedule.

• Strong process discipline and attention to detail.

• Ability to spot ownership gaps, missing deliverables, hidden dependencies, and execution risks early.

• Technical breadth across software, hardware, systems, applications, manufacturing, quality, service, and supply chain.

• Strong written, verbal, organizational, and executive communication skills.

• Ability to influence technical and operational leaders.

Preferred Qualifications

• Experience with optical metrology, inspection, APC, yield management, or semiconductor process equipment.

• Experience supporting foundry, logic, memory, or advanced packaging customers.

• Experience with NPI, product lifecycle, release, qualification, manufacturing readiness, or field deployment.

• Ability to connect COGS, gross margin, cost reduction, and technical tradeoffs.

• Experience building practical operating procedures, governance, or execution frameworks.

• Some formal leadership experience with strong cross-functional execution leadership.

Why Join Onto Innovation?

At Onto Innovation, we believe your work should matter—and so should your well-being. That’s why we offer competitive salaries and a comprehensive benefits package designed to support you and your family. From health, dental, and vision coverage to life and disability insurance, PTO, and a 401(k) with employer match, we’ve got you covered. You’ll also enjoy access to our Employee Stock Purchase Program (ESPP), wellness initiatives, and cutting-edge tools—all within a collaborative, inclusive culture where your contributions are valued and recognized.

Compensation & Growth

• Base Salary Range:

$102,400.00 - $153,600.00, offered in good faith and based on experience, location, and qualifications.

• Additional Rewards: Annual bonus opportunities and potential long-term incentives tied to both company and individual success.

Empowering Every Voice to Shape the Future:

Onto Innovation is committed to creating a workplace where every qualified candidate has an equal opportunity to succeed. We evaluate applicants based on skills, experience, and potential - without regard to race, color, religion, gender, sexual orientation, national origin, age, disability, veteran status, or any other characteristic protected by law. We believe diversity of thought and background drives innovation and strengthens our team.

Important Note on Export Compliance

For certain positions requiring access to technical data, U.S. export licensing review may be necessary for applicants who are not U.S. Citizens, Permanent Residents, or other protected persons under 8 U.S.C. 1324b(a)(3).