New College Grad - HBM Product Development Failure Analysis Engineer

Req ID:

JR110630 New College Grad - HBM Product Development Failure Analysis Engineer

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Product Development Failure Analysis (PDFA) team plays a critical role in bringing next-generation High Bandwidth Memory (HBM) products from initial design through high-volume manufacturing. The team partners closely with Product, Process, Quality, and Test Engineering organizations to identify, analyze, and resolve product and process-related issues that impact yield, reliability, and overall product performance.

As an HBM Product Yield Enhancement PDFA Engineer, you will focus on product reliability and component-level failure analysis during new HBM product introductions. You will use electrical characterization, physical analysis techniques, statistical methodologies, and AI-enabled data analysis tools to identify failure mechanisms and drive rapid production ramp. This role requires strong analytical skills, multi-functional collaboration, and the ability to translate complex data into actionable engineering solutions.

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### Responsibilities

• Perform electrical, physical, and statistical failure analysis to identify and understand component failure mechanisms.
• Analyze characterization and manufacturing data to determine root causes of fabrication, assembly, and test-related failures.
• Collaborate with Product, Process, Quality, and Test Engineering teams to resolve yield, reliability, and process defect issues.
• Leverage AI-enabled tools and statistical methods to evaluate large datasets, identify trends, and improve component performance.
• Communicate findings, corrective actions, and risk assessments to multi-functional partners to support successful product qualification and production ramp.

### Minimum Qualifications

• Bachelor's degree in Electrical Engineering, Computer Science, Physics, Materials Science, or a related technical field, or equivalent experience.
• Experience or coursework in semiconductor device physics, semiconductor manufacturing processes, or VLSI design.
• Demonstrated knowledge of statistical analysis techniques and data-driven problem solving.
• Experience using Python or similar programming languages for data analysis and engineering applications.
• Ability to analyze complex technical data and communicate findings effectively in a collaborative engineering environment.

### Preferred Qualifications

• Master's degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or a related field.
• Academic or industry experience in semiconductor failure analysis, yield enhancement, reliability engineering, or product characterization.
• Experience applying AI, Generative AI, or AI-assisted analytical tools to support engineering investigations and data analysis.
• Knowledge of test methodologies, process integration, and advanced memory technologies, including HBM products.
• Experience working with large datasets and applying statistical software or machine learning techniques to identify failure trends and process improvements.

Job Profile(s):

Product Development Engineer 1 - Product Development Engineer 2

Relocation Level: TBD

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