Engineer I -Process (Ball Attach)

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Job Description:

The Ball Attach Engineer I is responsible for supporting, establishing, and improving ball attach processes in PLP assembly operations. The role includes start-up/line ramp activities, including process recipe creation and sustaining production performance, driving yield improvement, and actively participating in. The position requires strong analytical capability, hands-on troubleshooting, and collaboration with cross-functional teams to ensure stable, efficient, and high-quality manufacturing operations.

Job Description:

• Lead and support start-up of Ball attach line and new products
• Establish initial process conditions and validate readiness for mass production
• Monitor early production performance and stabilize process during ramp-up phase
• Identify and mitigate start-up risks affecting yield, quality, and throughput
• Monitor and maintain ball attach process parameters to ensure stability and consistency
• Develop, define, and maintain ball attach process recipes (e.g., EFO settings, bonding force, ultrasonic power, time, temperature profiles)
• Perform DOE (Design of Experiments) to determine optimal process windows
• Continuously optimize recipes to improve yield, efficiency, and reliability
• Standardize and release qualified recipes for production use
• Ensure compliance with established process control plans and specifications
• Perform regular process audits and line checks
• Analyze yield trends and defect data (e.g., missing balls, ball bridging, ball deformation)
• Identify root causes and implement corrective and preventive actions
• Respond to production issues and equipment-related abnormalities
• Conduct root cause analysis using standard methodologies (5 Whys, Fishbone, 8D)
• Coordinate with Equipment, Quality, and Production teams for resolution
• Participate in process improvement projects and cost reduction activities
• Recommend and implement best practices for improved efficiency
• Maintain and update process documentation including work instructions and SOPs
• Ensure compliance with internal quality standards and audit requirements
• Support internal and external Customer audits

Requirements/Qualifications:

• Bachelor’s Degree in Engineering (Electronics, Industrial, Mechanical, Chemical, or equivalent)
• Minimum of 3 years experience in semiconductor specific to WLCSP or BGA process
• Experience on handling Ball Attach, Ball Repair, Reflow, Flux rinse and Shear process
• Working knowledge of SPC, MSA/GR&R, DOE, PFMEA, and problem-solving methodologies.
• Strong analytical and problem-solving skills; ability to interpret SPC charts and process data.
• Good communication skills and ability to work in a team-oriented environment.
• Knowledge of safety protocols and cleanroom practices.
• Strong experience with WLCSP or advanced packaging tools is highly preferred
• Proficiency in MS Office and maintenance management systems.
• Strong analytical and problem-solving skills
• Leadership and mentoring capability
• Good communication and teamwork skills
• High attention to detail and sense of accountability

Travel Time:

0% - 25%

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