- Location
- Hamburg, Hamburg, Germany
- Workplace
- Onsite
- Type
- Full-time
- Department
- Chip design & Packaging
- Seniority
- Senior
- Education
- PhD
- Source
- Recruitee
Description
eleQtron develops and operates full-stack quantum computers based on trapped-ion technology. Quantum computing is a new computing paradigm rapidly approaching commercial viability. Our unique approach combines laser-cooled trapped ions with microwave control and tailored magnetic fields. Our next-generation computing machines under development will be able to find solutions to problems that are out of reach today, thus enabling new innovative products and services for a brighter future.
We are looking for a Senior QPU Integration Engineer (Micro-fabrication focused). You will be a lead technical expert in our QPU Development team, driving the physical integration, yield optimization, and technology transfer of next-generation quantum processor architectures. In this pivotal role, you will serve as the primary bridge between chip design teams and fabrication engineers. You will own both front-end-of-line (FEOL) and back-end-of-line (BEOL) fabrication modules, leading R&D activities within our internal cleanroom facility while managing strategic development projects with external foundry partners.
Responsibilities:
Serve as the Subject Matter Expert (SME) for critical FEOL/BEOL fabrication modules (e.g., advanced lithography, thin-film deposition, metal/dielectric stack etch, dielectric isolation, surface passivation, and interconnects).
Lead end-to-end integration flows, evaluating and optimizing process interactions across multi-layer QPU stack architectures.
Collaborate closely with QPU designers, device physics teams, and packaging specialists to translate architectural requirements into manufacturable Design Rules (DRC) and process design kits (PDKs).
Feed cleanroom metrology, yield data, and failure analysis insights directly back into design and layout iterations.
Take the lead in managing daily internal cleanroom fabrication activities, schedule runs, set process baselines, and resolve real-time process deviations.
Oversee internal R&D projects to develop, qualify, and integrate novel materials, geometries, and process steps for next-gen QPU platforms.
Drive technology development and project management with external commercial foundry partners and research institutes.
Lead process transfer, yield matching, and contract negotiation for out-of-house fabrication and prototyping runs.
Lead Root Cause Analysis (RCA) and Process Failure Mode and Effects Analysis (PFMEA) for critical integration failures, lot losses, or performance degradation.
Define and maintain Statistical Process Control (SPC) guidelines, process windows, and target specifications across internal and external fabrication runs.
Mentor junior fabrication engineers and technicians on advanced processing techniques, cleanroom protocols, and experimental design (DOE).
Author comprehensive process specifications, standard operating procedures (SOPs), and technical roadmaps for executive and cross-functional review.