Lead Technology Architect – Optical Interconnects & Photonics Manufacturing (f/m/x)

ZEISS Semiconductor Manufacturing Technology

Enabler for smaller, more powerful, and more energy-efficient microchips 

  

Working for tomorrow today.  

Around 80 percent of all microchips worldwide are produced using ZEISS technologies. As the centerpiece of every electronically controlled system, they have become an integral part of our everyday lives – whether in smartphones, smart homes or smart factories. ZEISS is a technology leader in the field of semiconductor manufacturing equipment. With high-precision lithography optics, photomask systems and process control solutions, ZEISS enables the production of ever smaller, increasingly powerful, and more energy-efficient microchips, and thus plays a pivotal role in the age of micro- and nanoelectronics.  

To strengthen our organization, we are seeking a highly qualified and experienced Principal Technology Architect – Optical Interconnects & Photonics Manufacturing (f/m/x).

Your Role

• Transform deep industry expertise in photonics manufacturing into next-generation equipment concepts for ZEISS.
• Identify manufacturing bottlenecks and unmet equipment needs in photonics ramp-up and scaling.
• Initiate development of breakthrough concepts and architectures for ZEISS equipment solutions that enable photonic integration in semiconductor manufacturing.
• Own pre-development initiatives.
• Work closely with customers, foundries, OSATs, photonics packaging fabs, R&D institutes and internal ZEISS R&D teams to align technology roadmaps with real industrial manufacturing needs.
• Provide technical leadership to a growing interdisciplinary team, helping convert market and application insight into tangible tool requirements, architectures and demonstrators.
• Contribute to the long-term ZEISS SMT technology strategy by shaping high-impact opportunities at the intersection of semiconductor manufacturing, integrated photonics and AI data-center.

Your Profile

• Graduate degree in electrical engineering, semiconductor technology, photonics, physics or a closely related field.
• At least 3–5 years of relevant industry experience with direct exposure to photonics manufacturing, process integration, packaging and assembly, yield engineering and ramp-to-volume challenges.
• Deep technical understanding of photonic technologies for semiconductor applications.
• Knowledge of how photonics designs are made manufacturable, including PDK/design-rule constraints, test structures, wafer-level test, known-good-die strategies, process-control requirements and yield-learning loops.
• Professional network in the photonics and semiconductor ecosystem, preferably spanning chip manufacturers, foundries, OSATs, photonics packaging fabs, equipment suppliers, R&D institutes and/or AI infrastructure players.
• Strong analytical skills and the ability to convert application insight and cutting-edge technology trends into practical, differentiated equipment solutions.
• Ability to lead interdisciplinary technical work from concept to prototype, communicate with senior stakeholders and create clarity in an emerging technology field.
• Passion for shaping the future of semiconductor manufacturing by enabling integrated photonics for AI data-centers and high-performance computing applications.

Your ZEISS Recruiting Team:

Melike Bostanci, Ramona Schweizer