Senior / Principal Layout Engineer – Module Architecture (Pathfinding)
Micron Technology
·Yesterday
- Salary
- $202k – $344k
- Location
- San Jose, CA,US, US
- Workplace
- Hybrid
- Type
- Full-time
- Department
- Engineering
- Seniority
- Senior
- Experience
- 8+ years
- Source
- Eightfold
Description
Req ID:
JR105069 Senior / Principal Layout Engineer – Module Architecture (Pathfinding)
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
We are seeking a Senior / Principal Layout Engineer to drive pathfinding and architecture exploration for next-generation memory modules and form factors (DDR6, LPDDR6/LPDDR7, MRDIMM Gen3/Gen4, SOCAMM2 and beyond).
This role operates within the Module Architecture Group, focusing on pre-product definition, feasibility studies, and design tradeoff exploration. The ideal candidate brings deep expertise in high-speed layout, SI/PI co-design, and advanced PCB technologies, with the ability to influence architecture decisions through layout-driven insights and modeling-informed design.
Essential Duties and Responsibilities:
- Lead layout-driven architecture exploration for next-generation memory modules and interconnects
- Evaluate form factor, routing topology, and pinout tradeoffs to enable future bandwidth and density targets
- Define feasible design envelopes (routing complexity, layer count, escape feasibility, via strategy)
- Collaborate closely with SI/PI teams to co-optimize:
- Channel topology (fly-by, point-to-point, multi-drop evolution)
- Loss, reflection, and crosstalk mitigation strategies
- Return path integrity and reference plane design
- Define and influence SI/PI budgets at the module level
- Drive adoption of next-generation PCB technologies, including:
- Ultra-low-loss materials
- Advanced HDI (microvias, stacked vias, via-in-pad)
- Hybrid bonding / advanced packaging integration (where applicable)
- Help develop next-gen layout methodologies and constraints for >10–20+ Gb/s signaling
- Help define:
- Routing rules for extreme speed interfaces
- Skew/jitter budgets translated into physical constraints
- Reference design guidelines for future programs
- Establish design rules that bridge architecture → SI/PI → layout → manufacturing
- Drive design reviews, risk assessments, and trade-off analysis
- Influence JEDEC and industry standards through practical layout feasibility input
- Mentor junior engineers and shape layout best practices across the organization
Education/Experience requirements:
- Bachelor’s degree in Electrical Engineering or related field
- 8–15+ years of experience in high-speed PCB layout, with strong ownership of complex designs
- Deep expertise in:
- DDR/LPDDR memory interfaces or similar ultra-high-speed parallel interfaces
- Signal integrity (transmission lines, discontinuities, channel loss mechanisms)
- Power integrity (PDN design, target impedance, decoupling optimization)
- Advanced proficiency with:
- Cadence Allegro / OrCAD (or equivalent high-end layout tools)
- Proven ability to influence architecture decisions through physical design constraints
- Experience working in cross-functional architecture or pathfinding environments
- Proficient in using AI tools in daily job
Job Profile(s):
Systems Design Engineer 5
Relocation Level: TBD
Before Getting Started
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- If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.
The US base salary range that Micron Technology estimates it could pay for this full-time position is:
$202,000.00 - $344,000.00 a year
Additional compensation may include benefits, bonuses and equity.
Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.
Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc
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