- Location
- Boise, ID,US, US
- Type
- Full-time
- Department
- Engineering
- Experience
- 3+ years
- Source
- Eightfold
Description
Req ID:
JR108071 Process Integration Engineer
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Micron Idaho Semiconductor Manufacturing (Triton) LLC
Develop, maintain and improve one or more process module including design rules, structural and electrical specifications for alternative flows. Optimize existing process flows and develop creative solutions to meet product requirements. Design and execute Design of Experiments and analyze results with statistical analysis software tools like JMP. Feedback results to product for yield enhancement. Extract, monitor, analyze, and react to inline data, defect data, param data and probe data to fix yield issues, performance, reliability, add process margin and reduce costs. Work cross-functionally with Design, Product Engineering, Modeling, Yield Enhancement and Electrical and Physical Failure analysis teams, Defect Analysis, Param, and Quality teams to understand issues, targets, and priorities for development. Summarize complex problems, derive, explain actions taken to address them and drive team to execute. Define sub-milestones for the project within module. Maintain and enforce best possible communication between PI, Process Development and the Pilot Fab. Ensure timely documentation of R&D activities in module for transfer to Manufacturing.
Employer will accept a Master’s degree in Engineering, Material Sciences, Physical Sciences, Chemistry or related field and 3 years of experience in the job offered or related occupation.
Position requires:
1\. DRAM process flows, integration steps, and yield optimization strategies;
2\. JMP, Minitab, or similar tools for process characterization and troubleshooting;
3\. Failure analysis for yield and quality improvement;
4\. Statistical analysis and data visualization;
5\. Manufacturing Execution Systems (MES): SWR (Special Work Request), GCP (Global Change Process), QDR (Quality Deviation Report), and Klarity defect analysis software for fab operations;
6\. CrossModule Troubleshooting: Resolving issues across lithography, etch, Chemical Mechanical Polishing, and DRAM module specific processes; and
7\. Technology transfer from R&D to HVM fabs
Job Profile(s):
Semiconductor Process Engineer 4
Relocation Level: TBD
Before Getting Started
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