Hiring.Camp

Package Development Engineer

Micron Technology

·

Mar 6, 2026

Location
SG
Type
Full-time
Department
Engineering
Education
Bachelor
Source
Eightfold

Description

Integrate AI-assisted tool and insights into daily work to improve efficiency, quality or effectiveness. Contribute to a culture of continuous improvement by identifying, testing and sharing AI-enablement enhancement within one scope of work. Apply engineering and statistical methods to accelerate learning cycles from DOE through product qualifications. Partner with APTD and manufacturing teams to support LVM and RAR. Perform risk assessments (FMEA) and implement effective control plans and corrective actions for abnormal conditions. Enable smooth technology transfer from development to high‑volume manufacturing. Bachelor's degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or a related discipline. Operations support, including shift and weekend coverage, is required. Applied understanding of theoretical knowledge relevant to wafer fabrication or IC packaging or packaging reliability. Demonstrate strong engineering foundation. Strong analytical, structured problem‑solving, and data‑driven decision‑making skills like ANOVA and SPC, etc. Effective communication skills to collaborate across global, cross‑functional teams. Use AI -enabled tool responsibly and optimally for research, analysis, content creation, problem-solving, operational task, and achieving business outcome. Familiarity with MES systems, automation, and data analytics tools (e.g., JMP, Python).

Skills

Python

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