- Location
- Andover, MA,US, US
- Type
- Full-time
- Department
- Engineering
- Seniority
- Lead
- Source
- Eightfold
Description
Define package concepts for AI power supply products with focus on high-performance computing modules Validate package concepts through simulation and hardware demonstrators in cooperation with Back End development, product development and system architects Align new ideas and concepts with Back End development (in-house + OSAT) and initiate assembly projects Follow up and support package development projects until final release of the product Identify new development topics and incorporate them into the package roadmap Support our customers with package specific questions Stay up to date on package solutions through continuous market screening and competitor analysis Identify business opportunities enabled by new technologies and concepts Technical background, e.g. Degree in Physics or Electronics 6 years practical experience in assembly technologies with detailed knowledge of Back End processes and materials and their dependencies laminate design/ materials/ processes Background knowledge of SMT related technologies Experience with typical package design tools (e.g. Autocad/ Cadence) Very good communication and presentation skills We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.