Staff Packaging Engineer

##

Company:

Qualcomm China

## Job Area:

Engineering Group, Engineering Group > Packaging Engineering

General Summary:

Job overview: Member of IC packaging team directly supporting customers with packaging related quality issues, product development and new applications. Daily support for mechanical FA lab operation and packaging issues triage

Examples of customer support areas:

• Board level reliability (BLR) qualification.
• SMT (Surface Mount Technology)
• Packaging SMT/ BLR issue triage and root cause isolation
• Product launch into HVM (High Volume Manufacture)
• Design for manufacturability (DFM) reviews
• Technology roadmap alignment and spec compliance reviews
• Failing samples reviews
• Publication of application notes and process recommendations

Examples of lab operations support areas:

• FA (Failure Analysis) plan definition
• FA reports
• Lab daily operations supervisory
• Supports to technicians

Examples of advanced package technologies supported

• BGA (Ball Grid Array) and CSP (Chip Scale Package)
• WLP (Wafer Level Package)
• FO-WLP (Fan Out Wafer Level Package)
• PoP (Package on Package)
• LGA (Land Grid Array)
• Auto SiP (System In Package) Module

Other duties as needed

• Collaboration with internal teams (quality, design, NPI, modeling, etc) to give regular profess updates
• Project/ case management; statistical analysis including DOE methods
• Interface with external suppliers and equipment vendors to understand latest technologies
• Industrial benchmarking and competitive analysis

Minimum qualifications

• Required to be fluent in Mandarin with functional proficiency in English
• Permitted to work in mainland China with ability for oversea travel
• Minimum of five years of experience in SMT/ BLR and package technology development
• Must have strong written and oral communication

Working knowledge of

• Package assembly process
• Surface mount technology
• Package reliability testing and failure modes
• Underfill & rework
• High temperature warpage analysis
• Industry packaging trends and customer considerations
• Package material analysis
• Mechanical failure analysis techniques
• Failure analysis tools & data analysis (Microscope/ Shadow Morrie/ X-ray/ CSAM/ EDX/ IR…)
• IPC JEDEC and other industry specifications

Preferred qualifications

• Independent decision maker and problem solver with little oversight needed
• Previous experience with portable consumer products/ auto products and direct manufacturing experience with package assembly or SMT strongly preferred

Minimum Qualifications:

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.

OR

Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.

OR

PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience.

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