Boston Materials produces advanced materials with enhanced energy transfer properties using its patented Z-axis Carbon Fiber technology. The Company's products solve critical performance bottlenecks in applications spanning thermal, electrical, and structural use cases. Its breakthrough Liquid Metal ZRT thermal interface material is designed to solve thermal chokepoints that are facing the next generation of AI and HPC silicon. For more information, visit https://www.bomaterials.com/
THE OPPORTUNITY
A career-defining opportunity rarely offers all of the following:
Direct connection to the mission. Gain a clear understanding of the business and see how your work directly shapes outcomes. With no unnecessary layers, silos, or bureaucracy, every team member contributes meaningfully to the company's success and has the responsibility to drive real impact.
Growth beyond a single role. At Boston Materials, you are not defined by your past experience or limited by a job description. Working alongside leading experts in the field, you will take on new challenges, broaden your expertise, develop new capabilities, and take ownership of projects that matter – while contributing to the broader success of the organization.
Work on problems that matter. Help solve some of the most pressing challenges in the Advanced Semiconductor, AI Infrastructure, and Advanced Materials industries. Boston Materials offers a rare combination of purpose, autonomy, and impact. We invite you to join us.
The Role
We are seeking a motivated Mechanical Design Engineer to support the design, prototyping, and testing of our high-performance thermal interface material (TIM) products as customers evaluate and adopt them. This is an early-career role for a hands-on engineer who wants to build depth in mechanical design, semiconductor packaging, and thermal testing. Working under the guidance of senior engineers, you will create CAD models and drawings, build and test assembly mockups, and generate the data that supports customer qualification of our TIM in advanced semiconductor packages. You will be exposed to hyperscaler, ODM, and OSAT programs from day one, with a clear path toward owning customer-facing technical work as you grow.
Join us to solve one of the most critical challenges facing the semiconductor and electronics industry – thermal management!
