Hiring.Camp This job is no longer accepting applications. Similar open roles are listed below.
Advanced Packaging Technology Development Substrates Module Engineer On-Shift (Nightshift)
- Location
- USA - AZ - Chandler, United States of America
MTAdvanced Packaging Technology Development Engineer: Advance PKG stacking
Micron Technology·Taipei, Taiwan·Hybrid
MAdvanced Packaging Technology Development Engineer: Advance PKG stacking
Micron·Taichung, Taiwan·Hybrid
AAdvanced Packaging Technology & Integration Leader
Amat·Santa Clara, California·Remote, Hybrid
AMAdvanced Packaging Technology & Integration Leader
Applied Materials·Santa Clara, California·Hybrid
MTAdvanced Packaging Technology Development (APTD) Process Technical Specialist
Micron Technology·Singapore
MAdvanced Packaging Technology Development (APTD) Process Technical Specialist
Micron·Singapore
MTTechnician - Advanced Packaging Technology Development (APTD) Operations
Micron Technology·Singapore
MTechnician - Advanced Packaging Technology Development (APTD) Operations
Micron·Singapore
MTDirector, Advanced Packaging Technology Development
Micron Technology·Taipei, Taiwan·Hybrid
MDirector, Advanced Packaging Technology Development
Micron·Taichung, Taiwan·Hybrid
MTPackaging Area Shift Engineer, Advanced Packaging Technology Development
Micron Technology·Taipei, Taiwan
MTPackaging Area Shift Engineer, Advanced Packaging Technology Development
Micron Technology·Taipei, Taiwan
MPackaging Area Shift Engineer, Advanced Packaging Technology Development
Micron·Taichung, Taiwan
MPackaging Area Shift Engineer, Advanced Packaging Technology Development
Micron·Taichung, Taiwan
MStaff Engineer, Advanced Packaging Technology Development
Micron·Taichung, Taiwan
MSr Advanced Packaging Technology Development Engineer, Bonding process
Micron·Taichung, Taiwan·Hybrid, Onsite
MSr Advanced Packaging Technology Development Engineer, FILM process
Micron·Taichung, Taiwan·Onsite
MTStaff Engineer, Advanced Packaging Technology Development
Micron Technology·Taipei, Taiwan
MTSr Advanced Packaging Technology Development Engineer, FILM process
Micron Technology·Taipei, Taiwan·Onsite
MTSr Advanced Packaging Technology Development Engineer, Bonding process
Micron Technology·Taipei, Taiwan·Hybrid, Onsite
BStaff Program Manager - Advanced Packaging Technology
Broadcom·US·onsite
IAdvanced Packaging Technology Development Substrates Module Engineer On-Shift (Nightshift)
Intel·US·Onsite
MMATERIAL ENGINEER, ADVANCED PACKAGING TECHNOLOGY DEVELOPMENT
Micron·Taichung, Taiwan
MTMATERIAL ENGINEER, ADVANCED PACKAGING TECHNOLOGY DEVELOPMENT
Micron Technology·Taipei, Taiwan
ADirector, Advanced Packaging Disruptive Technology (Based in Singapore)
Amat·Austin, Texas +3
AMDirector, Advanced Packaging Disruptive Technology (Based in Singapore)
Applied Materials·Austin, Texas +4
ADirector, Advanced Packaging Disruptive Technology (Based in Singapore)
Amat·Austin, Texas +2
JLDirector, Advanced Power Silicon & Packaging Technology
Job Listings·Shanghai, China
MTStaff/Principal, APTD CEM - Advanced Packaging Wafer Level Technology Engineering
Micron Technology·Singapore
MTSenior Engineer Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering
Micron Technology·Singapore