Senior Packaging Engineer

Overview

At Microsoft Quantum, we aim to empower science and scientists to solve the world’s biggest problems by realizing advanced computing platforms at the intersection of high-performance computing, artificial intelligence, and quantum information technology. Microsoft Quantum will change the world of computing and help solve some of humankind’s currently unsolvable problems. For more information about our team, visit .

Microsoft's Quantum Systems organization is a multidisciplinary team advancing cutting-edge quantum technologies to address some of the world's most complex challenges. We are seeking a Senior Packaging Engineer with a focus on hands-on process and materials development to help shape the future of quantum systems in a dynamic, mission-driven environment.

In this role, you will adapt industry-standard packaging processes and materials to the unique requirements of quantum devices, working alongside a diverse team of engineers and scientists to assemble and scale complex quantum hardware. Success in this position requires close collaboration with our globally distributed team to establish common, robust assembly processes and materials.

At Microsoft, our mission—to empower every person and every organization on the planet to achieve more—guides how we partner with customers to deliver trusted, impactful solutions. With a growth mindset culture, we innovate responsibly and measure success by shared progress—people, teams, and customers. Join us to do meaningful work that changes the world and helps shape what’s next for everyone.

Responsibilities

• Develop and maintain robust assembly processes for quantum devices. Document processes and implementation across our global team.

• Drive external packaging material vendors to leverage existing supply chains to deliver solutions needed for packaging of quantum devices.

• Evaluate external packaging suppliers as scaling partners.

• Develop and implement test equipment and processes for evaluating packaging solutions

• Support development of advanced packaging technologies.

• Work in teams or independently as required.

• Other

  • Embody our culture and values.

Qualifications

Required/minimum qualifications:

• Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 3+ years technical engineering experience

  • OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 5+ years technical engineering experience

  • OR equivalent experience

Other qualifications:

Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to the following specialized security screenings:

• Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.

• Citizenship & Citizenship Verification: This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their U.S. permanent residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate’s citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.

Additional/preferred qualifications:

• Doctorate in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 3+ years technical engineering experience

  • OR Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 6+ years technical engineering experience

  • OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 8+ years technical engineering experience

  • OR equivalent experience

• Experience managing outside vendors.

• Demonstrates the ability to work across multi-disciplinary teams and effectively communicate to meet deadlines and deliver results.

• Experience with industry standard packaging materials and processes.

• Experience in cryogenic materials.

• Experience in microwave device packaging.

• Ability to leverage AI tools to drive innovation and efficiency, e.g., performance modeling and analysis, research gathering, day-to-day task automation.

• Evaluate agentic solutions with measurable metrics and human-in-the-loop safeguards following Microsoft Responsible AI requirements for generative AI.

Quantum #QuantumCareers #MDQCareers

Hardware Engineering IC4 - The typical base pay range for this role across the U.S. is USD $119,800 - $234,700 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $160,200 - $261,000 per year.

Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here:
https://careers.microsoft.com/us/en/us-corporate-pay

This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.