Staff Engineer, NAND TD, RDA

Req. ID:

JR100988 Staff Engineer, NAND TD, RDA

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

## Required Responsibilities

• Own the site-level RDA strategy and annual roadmap aligned to NAND TD technology nodes.

• Lead analysis of experimental and production flows to detect, classify, and trend systematic and random defects.

• Establish, track, and report program health metrics (baseline health, detection rates, false positives, MTTR).

• Direct fast containment for defect excursions: trigger tool quarantines, define hold criteria, and lead 8D corrective actions.

• Architect inspection recipes and sampling strategies; optimize sensitivity, throughput, and cost of ownership.

• Partner with Process Integration, Yield, and Data Science to correlate inspection signals to device performance and yield.

• Influence supplier roadmaps; evaluate, qualify, and release next‑gen optical/e-beam inspection capabilities.

• Standardize and disseminate Best Known Methods (BKM) across global TD and manufacturing sites.

• Mentor, coach, and upskill engineers; develop succession plans and technical ladders within the RDA domain.

• Champion safety and continuous improvement (CIP); drive kaizen/lean initiatives that improve cycle time and learning velocity.

## Key Responsibilities

• Serve as the technical lead for RDA methodologies and execution within NAND TD.

• Perform root cause analysis using statistical, image-based, and data-driven techniques.

• Develop, own, and communicate inspection and defect detection technology roadmaps.

• Define program health metrics and drive continuous improvement initiatives (CIP).

• Lead tool anomaly investigations, quarantine decisions, and corrective action planning.

• Collaborate globally to align Best Known Methods (BKM) across sites.

## Stakeholder Collaboration

• Technology Development (TD) Process and Integration teams

• Yield Analysis and Data Science organizations

• Global Manufacturing and Operations

• Inspection/metrology equipment suppliers

• Program and engineering leadership across regions

## Requirements :

• Bachelor’s degree with 7+ years relevant semiconductor experience, or Master’s/PhD with 5+ years.

• Minimum 1 year of hands-on RDA experience in semiconductor manufacturing or equipment engineering.

• Demonstrated expertise in defect inspection, process monitoring, and yield learning.

## Technical Competencies

• Realtime Defect Analysis (RDA) systems and workflows.

• Optical and e-beam inspection technologies.

• Statistical data analysis, correlation development, and large dataset interpretation.

• Semiconductor process integration and technology development.

• Root cause analysis and systematic problem solving (e.g., 8D, DMAIC).

## Leadership & Behavioral Competencies

• Recognized technical authority with the ability to influence without direct authority.

• Strong mentoring and coaching mindset with proven talent development outcomes.

• Clear, concise communication skills across technical and executive audiences.

• Ownership-driven, execution-focused; comfortable operating in ambiguity.

## Impact & Success Measures

• Reduced defect-related yield loss and faster learning cycles.

• On-time qualification and adoption of next-generation inspection capabilities.

• Uplift in organizational RDA skill depth and succession pipeline.

• Alignment of inspection strategy and capability to future NAND nodes.

Job Profile(s):

Semiconductor Process Engineer 4

Relocation level: (TBD)

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