Hiring.Camp

DMTS Process Development Engineer, Advanced Packaging

Micron Technology

·

Yesterday

Location
Boise, ID,US, US
Workplace
Hybrid
Type
Full-time
Department
Engineering
Education
PhD
Source
Eightfold

Description

Req ID:

JR112474 DMTS Process Development Engineer, Advanced Packaging

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Advanced Packaging Technology Development (APTD) team at Micron is shaping the future of memory and storage technologies that fuel the AI era. We collaborate with global R&D groups, suppliers, and manufacturing teams to turn bold ideas into production-ready solutions. We innovate fast, learn continuously, and work as one team! This position is intended to be part of Micron's Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others.

Position Overview:

We are seeking an experienced organizational leader who will lead and influence methodology improvements, including best practices in process development, data-driven decision-making, and application of AI/advanced analytics to drive innovation. In this role, you will drive strategic process development for Micron’s most advanced memory products, including HBM, 3DS DRAM, and emerging 3D architectures. You will guide end‑to‑end technology execution, partner across organizations, and influence both internal roadmaps and the external ecosystem. This is a high-impact role for someone who thrives at the intersection of innovation, complexity, and collaboration.

Responsibilities:

  • Own advanced packaging process technologies across wafer‑level and die‑level modules from pathfinding through manufacturing readiness
  • Develop and mature novel process flows, materials, and integration schemes that meet electrical, mechanical, thermal, cost, and reliability needs
  • Lead FOAK development, supplier engagement, and ecosystem collaboration to close capability gaps and accelerate learning
  • Drive structured problem solving for multi‑domain technical challenges and guide strategic decisions across programs
  • Lead technology transfer to manufacturing and influence packaging and integration decisions across product teams
  • Expected to leverage AI-enabled tools, automation, data analytics, and advanced modeling methods to accelerate process development, strengthen decision-making, and improve technical outcomes across advanced packaging programs.

Minimum Qualifications:

  • MS in Chemistry, Chemical Engineering, Materials Science, or related field (or equivalent experience)
  • 15+ years in semiconductor process development, manufacturing, or advanced packaging
  • Deep expertise in wafer‑level or die‑level processes such as CMP, etch, cleans, thin films, lithography, hybrid bonding, TCB, dicing, or molding
  • Strong understanding of semiconductor process integration and materials interactions
  • Proven experience leading complex cross‑functional technical programs

Preferred Qualifications:

  • PhD in a relevant technical field
  • Extensive experience with advanced memory technologies or 3D packaging architectures
  • Experience mentoring other engineers and driving technical methodology improvements
  • Familiarity with materials characterization and simulation (thermal, mechanical, electrical)

Job Profile(s):

Semiconductor Process Eng DMTS

Relocation Level: TBD

Before Getting Started

Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that:

  • Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.
  • If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

To learn about your right to work click here.

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at [email protected] or 1-800-336-8918 (select option #3)

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